HONG YE SILICONE Electronic Potting Compound for Embedded Passive Devices (EPDs) is a high-precision two-component Addition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for EPD protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low viscosity, excellent temperature resistance (-60℃ to 220℃), and strong adhesion. It cures at room or heated temperatures, fills tiny gaps of EPDs, minimizes signal interference, adheres well to PC, PCB and metals, protects EPDs, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Embedded Passive Devices (EPDs), dedicated to encapsulating, sealing, insulating and protecting resistors, capacitors, inductors and other passive components embedded in PCBs or modules. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for EPD’s small size and embedded installation, enhancing fine gap penetration, low dielectric loss and structural stability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and good flexibility, avoiding damage to tiny EPDs and ensuring stable device performance. Key Features & Advantages
- Ultra-Low Viscosity & Fine Gap Penetration: Customizable ultra-low viscosity formula, excellent fluidity, easily filling tiny gaps between embedded passive devices and PCB substrates, ensuring full encapsulation without dead corners, critical for EPD’s compact installation protection.
- Excellent Thermal Stability & Stress Absorption: Stable performance from -60℃ to 220℃, effectively dissipating heat generated by EPDs during operation; absorbs thermal stress caused by high-temperature cycles, protecting tiny passive components and their solder joints from damage, extending service life.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PCB, aluminum, copper and stainless steel, tightly bonding embedded passive devices to substrates; no corrosion or damage to delicate EPDs, ensuring firm and long-lasting encapsulation without peeling or detachment.
- Low Interference & High Insulation: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), isolating adjacent EPDs and circuit paths, avoiding signal crosstalk and electromagnetic interference, ensuring stable EPD and overall circuit performance.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and curing speed to match different EPD sizes and embedded layouts.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects gap penetration and adhesion to embedded passive devices and PCBs.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause short circuits or signal interference between EPDs and circuits.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto embedded passive devices to ensure full infiltration of tiny gaps.
- Curing: Place the encapsulated EPDs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and bonding performance.
Application Scenarios
This specialized electronic potting compound is widely used for Embedded Passive Devices (EPDs), including embedded resistors, capacitors, inductors, PCB-embedded passive modules and compact electronic assemblies. It is suitable for industries such as consumer electronics, automotive electronics, industrial control and medical equipment, ensuring stable operation of EPDs in compact, high-density devices. It enhances EPD reliability, reduces component failure rate, improves circuit stability, and is compatible with Rapid prototyping silicone to accelerate new EPD-integrated product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (ultra-low for fine gaps); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global embedded passive device production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide EPD-specific tailored solutions: custom formulations (adjust viscosity for fine gaps, insulation and curing speed), anti-interference optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (viscosity, adhesion, thermal stability), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for tiny embedded passive devices?
A: Yes, it has ultra-low viscosity and excellent gap penetration, adapting to small EPDs and their embedded gaps.
Q: Will it damage delicate EPDs?
A: No, it has no exotherm and low shrinkage, avoiding damage to tiny passive components.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific EPD sizes?
A: Yes, we adjust viscosity and hardness to match different EPD specifications and embedded layouts.
Shenzhen Hong Ye Jie Technology Co., Ltd
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