Product Overview
Our Electronic Potting Compound is specially developed for Miniature Component Arrays, dedicated to encapsulating, sealing, insulating and protecting miniature electronic arrays, micro-components, fine-pitch PCB arrays and tiny connectors. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for the ultra-small size and dense layout of miniature arrays, enhancing ultra-low viscosity, fine gap penetration and low signal interference. Compared withepoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and good flexibility, avoiding damage to fragile miniature components and ensuring stable performance.
Key Features & Advantages
- Ultra-Low Viscosity & Fine Gap Penetration: Customizable low viscosity formula, excellent fluidity, easily filling tiny gaps (≤0.1mm) between miniature components and dense arrays, ensuring full encapsulation without missing any precision parts, critical for miniature array protection.
- Excellent Temperature & Thermal Stability: Stable performance from -60℃ to 220℃, withstanding temperature fluctuations during miniature array operation; absorbs thermal stress caused by high-temperature cycles, protecting tiny chips, welding gold wires and delicate components from damage.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PCB, aluminum, copper and stainless steel, tightly bonding miniature components and substrates; no corrosion or damage to tiny parts, ensuring firm and long-lasting encapsulation without peeling.
- Low Volatility & High Safety: Ultra-low volatile content, no harmful residues or outgassing, avoiding contamination of sensitive miniature components; non-toxic, non-hazardous, complying with international environmental and safety standards, suitable for precision electronic manufacturing.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and curing speed to match different miniature array sizes.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects gap penetration and adhesion to miniature components.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause short circuits or component damage in dense arrays.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto miniature component arrays to ensure full infiltration of tiny gaps.
- Curing: Place the encapsulated arrays at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and bonding performance.
Application Scenarios
This specialized electronic potting compound is widely used for Miniature Component Arrays, including microelectronic arrays, fine-pitch PCB assemblies, miniature sensor arrays, tiny connector arrays and precision electronic modules. It is suitable for industries such as consumer electronics, medical devices, aerospace and industrial control, ensuring stable operation of miniature arrays in compact, high-precision equipment. It enhances array reliability, reduces component failure rate, extends service life, and is compatible with Rapid prototyping silicone to accelerate new miniature product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (ultra-low for fine gaps); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international precision electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global miniature component array production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide miniature component array-specific tailored solutions: custom formulations (adjust viscosity for tiny gaps, insulation and curing speed), fine gap penetration optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (viscosity, adhesion, gap penetration), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for ultra-small miniature component arrays?
A: Yes, it has ultra-low viscosity and excellent gap penetration, adapting to tiny gaps (≤0.1mm) of miniature arrays.
Q: Will it damage fragile miniature components?
A: No, it has no exotherm and low shrinkage, avoiding component damage.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific array sizes?
A: Yes, we adjust viscosity and hardness to match different miniature array specifications.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
