HONG YE SILICONE Electronic Potting Compound for High-Frequency Circuits is a high-precision two-component Addition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for high-frequency circuit protection. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, low dielectric loss, excellent temperature resistance (-60℃ to 220℃), and strong adhesion. It cures at room or heated temperatures, minimizes signal attenuation, adheres well to PC, PCB and metals, protects high-frequency components, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for High-Frequency Circuits, dedicated to encapsulating, sealing, insulating and anti-interfering electronic components, PCB assemblies, high-frequency connectors and signal transmission modules in high-frequency scenarios. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high-frequency operation, enhancing low dielectric loss, high insulation and anti-signal interference. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and good flexibility, avoiding signal distortion and ensuring stable high-frequency signal transmission.
Key Features & Advantages
- Low Dielectric Loss & Minimal Signal Attenuation: Ultra-low dielectric loss (tanδ ≤0.001 at 1GHz), effectively reducing high-frequency signal attenuation and distortion, ensuring stable signal transmission for circuits working at MHz to GHz frequency ranges, critical for high-frequency device performance.
- Excellent High Insulation & Anti-Interference: High dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), isolating adjacent high-frequency circuits, avoiding crosstalk and electromagnetic interference (EMI), ensuring clear and stable signal transmission.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PCB, aluminum, copper and stainless steel, tightly bonding high-frequency components and substrates; no corrosion or damage to circuit pads and delicate components, ensuring firm and long-lasting encapsulation.
- Low Volatility & High Safety: Ultra-low volatile content, no harmful residues or outgassing, avoiding contamination of sensitive high-frequency components; non-toxic, non-hazardous, complying with international environmental and safety standards, suitable for precision high-frequency electronic manufacturing.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize viscosity, hardness and curing speed to match different high-frequency circuit specifications.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects dielectric performance and signal transmission of high-frequency circuits.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause signal interference or circuit short circuits.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto high-frequency circuits to ensure full coverage of core components and signal paths.
- Curing: Place the encapsulated circuits at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and dielectric performance.
Application Scenarios
This specialized electronic potting compound is widely used for High-Frequency Circuits, including communication equipment (5G base stations, routers), radar systems, microwave devices, high-frequency PCB assemblies and precision electronic sensors. It is suitable for encapsulating high-frequency components such as signal transmitters, connectors and control modules, ensuring stable signal transmission in high-frequency operation. It enhances circuit reliability, reduces signal distortion, extends service life, and is compatible with Rapid prototyping silicone to accelerate new high-frequency product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss (tanδ): ≤0.001 (1GHz); Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international high-frequency electronic, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global high-frequency circuit production requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide high-frequency circuit-specific tailored solutions: custom formulations (adjust dielectric loss, insulation and curing speed), anti-interference optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (dielectric loss, insulation, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-frequency circuits (GHz range)?
A: Yes, it has ultra-low dielectric loss, adapting to MHz to GHz frequency ranges, ensuring minimal signal attenuation.
Q: Will it cause signal distortion?
A: No, it has excellent anti-interference and low dielectric loss, avoiding signal distortion.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific frequency requirements?
A: Yes, we adjust dielectric properties to match different high-frequency circuit needs.
Shenzhen Hong Ye Jie Technology Co., Ltd
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