Product Overview
Our Electronic Potting Compound is specially developed for Extreme Temperature Ranges, dedicated to encapsulating, sealing, insulating and protecting electronic components, PCB assemblies, connectors and sensitive modules in ultra-high or ultra-low temperature environments. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for drastic temperature fluctuations, enhancing thermal stability, temperature resistance and stress absorption. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and good flexibility, avoiding cracking or peeling under extreme temperature cycles.
Key Features & Advantages
- Superior Extreme Temperature Resistance: Stable performance in a wide range of -60℃ to 220℃, withstanding continuous operation in ultra-low and ultra-high temperature environments; no performance degradation, cracking or brittle failure even under drastic temperature changes (from -60℃ to 220℃ in a short time).
- Excellent Thermal Stability & Stress Absorption: Effectively absorbs thermal stress caused by extreme temperature cycles, protecting chips, welding gold wires and delicate components from damage; low thermal expansion coefficient, ensuring structural stability of encapsulated components in temperature fluctuations.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PCB, aluminum, copper and stainless steel, maintaining firm bonding even under extreme temperatures; no corrosion or damage to electronic parts, ensuring long-lasting encapsulation and protection.
- Low Volatility & High Safety: Ultra-low volatile content, no harmful residues or outgassing, avoiding contamination of sensitive electronic components; non-toxic, non-hazardous, complying with international environmental and safety standards, suitable for extreme temperature industrial and scientific applications.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity and curing speed to match different extreme temperature requirements.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects thermal stability and adhesion under extreme temperatures.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause structural weaknesses and component damage in temperature cycles.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then pour it into components to ensure full coverage of core parts.
- Curing: Place the encapsulated components at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and thermal stability.
Application Scenarios
This specialized electronic potting compound is widely used in Extreme Temperature Ranges, including aerospace equipment, automotive electronics (engine compartments, cold regions), industrial ovens, cryogenic equipment and outdoor harsh environment instruments. It is suitable for encapsulating components such as PCB assemblies, sensors, connectors and control modules, ensuring stable operation in ultra-low (-60℃) and ultra-high (220℃) temperature conditions. It enhances component reliability, extends service life, reduces maintenance costs, and is compatible with Rapid prototyping silicone to accelerate new product R&D for extreme temperature applications. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international industrial, electronic safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global extreme temperature environment application requirements, trusted by global manufacturers and procurement partners.
Customization Options
We provide extreme temperature-specific tailored solutions: custom formulations (adjust temperature resistance range, thermal stability and curing speed), thermal stress optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (temperature resistance, thermal stability, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for both ultra-low and ultra-high temperatures?
A: Yes, it operates stably from -60℃ to 220℃, adapting to various extreme temperature scenarios.
Q: Will it crack under drastic temperature changes?
A: No, it has good flexibility and stress absorption, avoiding cracking in temperature cycles.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for wider temperature ranges?
A: Yes, we adjust the formula to match specific extreme temperature requirements of customers.
Shenzhen Hong Ye Jie Technology Co., Ltd
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