HONG YE SILICONE Electronic Potting Compound for Hermetic Sealing Applications is a high-performance two-component Addition Curing Silicone, also known as Silicone Encapsulant and electronic Potting Compound, tailored for hermetic sealing scenarios. Crafted from high-purity Silicone raw materials, it features adjustable weight mixing ratio, ultra-low volatility, excellent temperature resistance (-60℃ to 220℃), and superior hermetic sealing. It cures at room or heated temperatures, adheres well to PC, PCB, PMMA and metals, protects electronic components from external contaminants, complies with EU RoHS, and supports full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting Compound is specially developed for Hermetic Sealing Applications, dedicated to providing airtight, waterproof, dustproof and corrosion-resistant protection for electronic components, PCB assemblies, precision connectors and sensitive electronic modules. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for hermetic sealing’s strict airtight requirements, enhancing bonding strength, low permeability and environmental adaptability. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and excellent flexibility, ensuring long-term hermetic sealing without cracking or leakage.
Key Features & Advantages
- Superior Hermetic Sealing Performance: Ultra-low permeability, forming an airtight barrier after curing, effectively preventing moisture, dust, gas and chemical contaminants from entering, protecting sensitive electronic components from damage, and ensuring long-term stable operation in harsh environments.
- Excellent Temperature & Environmental Stability: Stable performance from -60℃ to 220℃, withstanding extreme temperature fluctuations; excellent resistance to ozone, oxidation and chemical erosion, adapting to various harsh working environments of hermetic sealing applications.
- Strong Adhesion & Wide Compatibility: Excellent adhesion to PC, PMMA, PCB, aluminum, copper and stainless steel, tightly bonding components and substrates; no corrosion or damage to electronic parts, ensuring firm and long-lasting hermetic sealing.
- Low Volatility & High Safety: Ultra-low volatile content, no harmful residues or outgassing, avoiding contamination of sensitive electronic components; non-toxic, non-hazardous, complying with international environmental and safety standards.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity and curing speed to match different hermetic sealing scenarios.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects hermetic sealing and adhesion performance.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause sealing gaps or leakage.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then pour it into components to ensure full coverage of sealing areas and tiny gaps.
- Curing: Place the encapsulated components at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed and sealing performance.
Application Scenarios
This specialized electronic potting compound is widely used in hermetic sealing applications, including aerospace electronic components, automotive electronic modules, industrial control devices, medical equipment and precision electronic instruments. It is suitable for hermetic sealing of PCB assemblies, sensitive sensors, connectors and electronic modules, ensuring stable operation in high-humidity, dusty, corrosive and extreme temperature environments. It enhances component reliability, extends service life, reduces maintenance costs, and is compatible with Rapid prototyping silicone to accelerate new product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic sealing, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global hermetic sealing application requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide hermetic sealing-specific tailored solutions: custom formulations (adjust sealing performance, viscosity and curing speed), low permeability optimization, and flexible packaging to meet large-scale production and prototype R&D needs of different industries.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (hermetic sealing, adhesion, temperature resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-demand hermetic sealing?
A: Yes, it has ultra-low permeability and strong adhesion, meeting strict airtight requirements of various scenarios.
Q: Will it damage sensitive electronic components?
A: No, it has low volatility and no exotherm, avoiding component contamination and damage.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for specific sealing needs?
A: Yes, we adjust formula parameters to match different hermetic sealing requirements.
Shenzhen Hong Ye Jie Technology Co., Ltd
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