Product Overview
Our Electronic Potting Compound is specially developed for High-Density Interconnects, dedicated to encapsulating, sealing, insulating and protecting HDI circuit boards, fine-pitch connectors, micro-vias and signal transmission paths. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for HDI’s high-density, fine-line scenarios, enhancing low viscosity, strong adhesion and low signal interference to adapt to HDI’s strict precision requirements. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and absorbs thermal stress, avoiding damage to HDI’s fine circuits and ensuring stable signal transmission.
Key Features & Advantages
- Ultra-Low Viscosity & Fine Gap Penetration: Low viscosity formula, excellent fluidity, easily filling HDI’s tiny micro-vias, fine circuits and narrow gaps between components, ensuring full encapsulation without missing any precision parts, critical for HDI’s high-density design.
- Ultra-High Insulation & Low Signal Interference: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength (≥25 kV/mm), effectively isolating adjacent HDI circuits, avoiding crosstalk and signal attenuation, ensuring stable and accurate signal transmission.
- Excellent Temperature & Thermal Stability: Stable performance from -60℃ to 220℃, withstanding temperature fluctuations during HDI operation; absorbs thermal stress caused by high-temperature cycles, protecting HDI chips, welding gold wires and fine circuits from damage, extending service life.
- Strong Adhesion & Compatibility: Excellent adhesion to PC, PCB, aluminum, copper and stainless steel, tightly bonding HDI components and substrates; compatible with HDI’s common materials, no corrosion or damage to fine circuits and pads.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity and operation time to match different HDI board models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects insulation and adhesion to HDI fine circuits.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause circuit short circuits or signal interference.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it onto HDI boards to ensure full infiltration of micro-vias and fine gaps.
- Curing: Place the encapsulated HDIs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specializedelectronic potting compound is exclusively for High-Density Interconnects, including HDI circuit boards, fine-pitch PCB assemblies, microelectronic modules and high-precision electronic devices. It is suitable for encapsulating HDI circuit boards, micro-vias, fine connectors and signal paths, ensuring stable operation in aerospace, automotive electronics, consumer electronics and industrial control fields. It enhances HDI reliability, reduces circuit failure rate, improves signal stability, and is compatible with Rapid prototyping silicone to accelerate new HDI product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable (low viscosity for fine gap penetration); Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international electronic interconnect, safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global HDI production and performance requirements, trusted by global electronics manufacturers and procurement partners.
Customization Options
We provide HDI-specific tailored solutions: custom formulations (adjust viscosity for fine gaps, insulation and curing speed), low signal interference optimization, and flexible packaging to meet large-scale production and prototype R&D needs of HDI manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, viscosity, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global HDI orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for fine-pitch HDI boards?
A: Yes, it has low viscosity and excellent gap penetration, adapting to HDI’s fine circuits and micro-vias.
Q: Will it damage HDI fine circuits?
A: No, it has no exotherm and low shrinkage, avoiding circuit damage.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: Can it be customized for low-viscosity needs?
A: Yes, we adjust viscosity to match HDI’s tiny gaps.
Shenzhen Hong Ye Jie Technology Co., Ltd
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