Product Overview
Our Electronic Potting Compound is specially developed for Micro-Electrode Arrays, dedicated to encapsulating, sealing, insulating and protecting MEA micro-electrode tips, connection pads, PCB substrates and signal transmission components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high-sensitivity MEA working scenarios, enhancing ultra-low signal interference, high purity and corrosion resistance to adapt to the strict precision requirements of MEAs. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and absorbs thermal stress, ensuring stable signal transmission and detection accuracy of MEAs.
Key Features & Advantages
- Ultra-Low Signal Interference: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength (≥25 kV/mm), avoiding interference with MEA weak electrical signals, ensuring accurate detection and transmission of bioelectrical or electrochemical signals without distortion.
- High Purity & Non-Toxicity: Ultra-low volatile content, no harmful residues or outgassing, avoiding contamination of MEA micro-electrode tips and test samples (especially biological samples), complying with laboratory and medical-grade safety requirements.
- Wide Temperature Adaptability & Stability: Stable performance from -60℃ to 220℃, withstanding temperature fluctuations in laboratory and industrial testing environments; effectively absorbing thermal stress, protecting MEA micro-electrodes and welding gold wires from damage, extending service life.
- Strong Adhesion & Corrosion Resistance: Excellent adhesion to PC, PMMA, PCB, aluminum, copper and stainless steel, ensuring tight sealing of MEA components; superior anti-ozone and chemical erosion resistance, adapting to corrosive testing environments.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity and operation time to match different MEA models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects insulation and signal performance.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause micro-electrode damage or signal distortion.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then carefully pour it into MEA components to avoid damaging micro-electrode tips.
- Curing: Place the encapsulated MEAs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is exclusively for Micro-Electrode Arrays, including biological MEAs, electrochemical MEAs, neural MEAs and industrial testing MEAs. It is suitable for encapsulating MEA micro-electrode tips, connection pads and PCB substrates, ensuring stable operation in biological research, neural science, electrochemical testing and medical diagnosis fields. It enhances MEA signal accuracy, reduces failure rate, extends service life, and is compatible with Rapid prototyping silicone to accelerate new MEA product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international precision laboratory, biological and electronic equipment standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global MEA safety and performance requirements, trusted by global research institutions, medical and industrial equipment procurement partners.
Customization Options
We provide MEA-specific tailored solutions: custom formulations (adjust insulation, viscosity and curing speed), low-volatility optimization for micro-electrode protection, and small-batch packaging to meet large-scale production and laboratory R&D needs of MEA manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, signal interference, purity), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global MEA orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for biological MEAs?
A: Yes, it has high purity and no toxicity, avoiding contamination of biological samples.
Q: Will it damage MEA micro-electrode tips?
A: No, it has low shrinkage and no exotherm, protecting fragile micro-electrodes.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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