Product Overview
Our Electronic Potting Compound is specially developed for Plasma Focus Devices, dedicated to encapsulating, sealing, insulating and protecting PFD high-voltage control modules, PCB substrates, electrode connectors and signal transmission components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high-temperature, high-voltage PFD working scenarios, enhancing plasma erosion resistance, high insulation and thermal stability to adapt to the harsh operation requirements of PFDs. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and absorbs thermal and mechanical stress, ensuring stable plasma generation and device operational safety.
Key Features & Advantages
- Superior High-Temperature & Plasma Resistance: Stable performance from -60℃ to 220℃, withstanding extreme temperature fluctuations during PFD plasma generation; excellent resistance to plasma erosion and high-energy particle impact, protecting core components from damage and extending device service life.
- Ultra-High Insulation & Safety: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength (≥25 kV/mm), effectively isolating high-voltage interference, avoiding short circuits and electric arcs, ensuring safe operation of PFD high-voltage modules.
- Strong Corrosion & Environmental Adaptability: Superior anti-ozone, anti-oxidation and chemical erosion resistance, adapting to the corrosive environment generated by plasma; waterproof, moisture-proof and dust-proof, protecting PFD components from external environmental damage.
- Low Shrinkage & Strong Adhesion: No exotherm during curing, low shrinkage rate, avoiding component deformation; excellent adhesion to PC, PMMA, PCB, aluminum, copper and stainless steel, ensuring tight sealing and stable bonding of PFD components.
- Easy Operation & Customizability: Adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity and operation time to match different PFD models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects insulation and high-temperature performance.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause component damage or insulation failure.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then pour it into PFD components for encapsulation, ensuring full coverage of high-voltage parts.
- Curing: Place the encapsulated PFDs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is exclusively for Plasma Focus Devices, including laboratory PFDs, industrial plasma processing PFDs, nuclear fusion research PFDs and plasma diagnostic PFDs. It is suitable for encapsulating high-voltage control modules, electrode connectors and PCB substrates, ensuring stable operation in nuclear fusion research, plasma processing, material science and laboratory analysis fields. It enhances PFD operational stability, reduces failure rate, ensures operational safety, and is compatible with Rapid prototyping silicone to accelerate new PFD product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international plasma equipment, high-voltage safety and environmental protection standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global PFD safety and performance requirements, trusted by global research institutions, industrial and laboratory equipment procurement partners.
Customization Options
We provide PFD-specific tailored solutions: custom formulations (adjust high-temperature resistance, insulation and curing speed), plasma erosion resistance optimization, and flexible packaging to meet large-scale production and laboratory R&D needs of PFD manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, high-temperature resistance, plasma erosion resistance), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global PFD orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for high-voltage PFDs?
A: Yes, it has ultra-high insulation performance, adapting to PFD high-voltage operation requirements.
Q: Will it resist plasma erosion?
A: Yes, it is optimized for plasma resistance, protecting components from high-energy particle damage.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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