Product Overview
Our Electronic Potting Compound is specially developed for Surface Acoustic Wave Filters, dedicated to encapsulating, sealing, insulating and protecting SAWF piezoelectric chips, interdigital transducers (IDTs), control boards and precision electronic components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high-frequency SAWF working scenarios, enhancing ultra-low signal interference, high insulation and dimensional stability to adapt to the high-precision signal filtering requirements of SAWFs. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and absorbs thermal stress, ensuring stable acoustic wave transmission and filtering accuracy of SAWFs.
Key Features & Advantages
- Ultra-Low Signal Interference: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength (≥25 kV/mm), ultra-low dielectric loss, avoiding interference with SAWF high-frequency acoustic signals, ensuring precise signal filtering and transmission without distortion.
- Superior Insulation & Corrosion Resistance: Excellent waterproof, moisture-proof and dust-proof performance, isolating external static, moisture and corrosive substances; strong anti-ozone and chemical erosion resistance, protecting SAWF piezoelectric chips and IDTs from damage, extending service life.
- Wide Temperature Adaptability & Stability: Stable performance from -60℃ to 220℃, withstanding extreme temperature fluctuations in electronic equipment operation; no aging or performance degradation, ensuring long-term reliable operation of SAWFs in harsh working conditions.
- High Purity & Easy Operation: Minimal volatile content, no harmful residues or outgassing, avoiding contamination of SAWF precision components and affecting filtering performance; adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency.
- Strong Adhesion & Customizability: Excellent adhesion to PC, PMMA, PCB, aluminum, copper and stainless steel, ensuring tight sealing of SAWF components; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity, operation time and anti-interference performance to match different SAWF models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects insulation and anti-interference performance.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause signal distortion and component damage.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then pour it into SAWF components for encapsulation.
- Curing: Place the encapsulated SAWFs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is exclusively for Surface Acoustic Wave Filters, including RF SAWFs, mobile communication SAWFs, industrial control SAWFs and automotive SAWFs. It is suitable for encapsulating SAWF piezoelectric chips, IDTs, control boards and precision chips, ensuring stable operation in mobile communication, automotive electronics, industrial control and RF communication fields. It enhances SAWF filtering precision, reduces signal loss, extends service life, reduces maintenance costs, and is compatible with Rapid prototyping silicone to accelerate new SAWF product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international RF electronic equipment, communication and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global SAWF safety and performance requirements, trusted by global mobile communication, automotive and industrial electronic equipment procurement partners.
Customization Options
We provide SAWF-specific tailored solutions: custom formulations (adjust anti-interference performance, viscosity and curing speed), low-volatility optimization for precision component protection, and small-batch packaging to meet large-scale production and R&D needs of SAWF manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, anti-interference, purity), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global SAWF orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for mobile communication SAWFs?
A: Yes, it has ultra-low signal interference, adapting to SAWF high-frequency filtering requirements.
Q: Will it affect SAWF signal transmission?
A: No, its low dielectric loss and high purity ensure stable acoustic wave transmission and filtering accuracy.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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