Product Overview
Our Electronic Potting Compound is specially developed for Digital Micro-Mirror Devices, dedicated to encapsulating, sealing, insulating and protecting DMD micro-mirror arrays, control chips, PCB substrates and signal transmission components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high-precision DMD working scenarios, enhancing low optical interference, high purity and dimensional stability to adapt to the strict precision requirements of DMDs. Compared with epoxy potting resin, it has minimal volatile content, no exotherm during curing, low shrinkage, and absorbs thermal stress, ensuring stable micro-mirror operation and image projection accuracy of DMDs.
Key Features & Advantages
- Ultra-Low Optical Interference: High-purity formula with minimal volatile content and no outgassing, avoiding contamination of DMD micro-mirror surfaces and optical paths, ensuring clear image projection without distortion or light scattering.
- Superior Insulation & Stability: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength (≥25 kV/mm), isolating static and electromagnetic interference, protecting DMD control chips and signal circuits, ensuring stable micro-mirror switching and signal transmission.
- Wide Temperature Adaptability: Stable performance from -60℃ to 220℃, withstanding temperature fluctuations during DMD operation; effectively absorbing thermal stress, protecting micro-mirror arrays and welding gold wires from damage, extending DMD service life.
- Strong Adhesion & Easy Operation: Excellent adhesion to PC, PMMA, PCB, aluminum, copper and stainless steel, ensuring tight sealing of DMD components; adjustable weight mixing ratio, optional vacuum degassing (0.01MPa for 3 minutes), curable at room or heated temperatures, improving encapsulation efficiency.
- Customizable & Reliable: As a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity, operation time and optical performance to match different DMD models; strict quality control ensures consistent performance, reducing DMD failure rate.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects insulation and optical performance.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause component damage or optical interference.
- Degassing (Optional): After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, then pour it into DMD components for encapsulation.
- Curing: Place the encapsulated DMDs at room temperature or heat to accelerate curing; enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized electronic potting compound is exclusively for Digital Micro-Mirror Devices, including projection DMDs, industrial imaging DMDs, medical imaging DMDs and optical detection DMDs. It is suitable for encapsulating DMD micro-mirror arrays, control chips and PCB substrates, ensuring stable operation in projection equipment, industrial imaging, medical diagnosis and optical communication fields. It enhances DMD image accuracy, reduces failure rate, extends service life, and is compatible with Rapid prototyping silicone to accelerate new DMD product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international precision optical equipment, medical and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global DMD safety and performance requirements, trusted by global projection, medical and industrial imaging equipment procurement partners.
Customization Options
We provide DMD-specific tailored solutions: custom formulations (adjust optical performance, viscosity and curing speed), low-volatility optimization for micro-mirror protection, and small-batch packaging to meet large-scale production and R&D needs of DMD manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, optical interference, purity), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for global DMD orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when sealed and stored properly.
FAQ
Q: Is it suitable for projection DMDs?
A: Yes, it has ultra-low optical interference, adapting to DMD high-precision image projection requirements.
Q: Will it affect DMD micro-mirror operation?
A: No, its low shrinkage and stress absorption ensure stable micro-mirror switching and performance.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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