Product Overview
This high-frequency optimized Electronic Encapsulation Adhesive includes addition curing and condensation curing types, serving as high-quality industrial Silicone raw materials for precision high-frequency equipment. It offers outstanding adhesion and thermal stability for PCB, CPU, PC and PMMA substrates, plus aluminum, copper and stainless steel metals. After curing, the flexible silicone layer absorbs high-frequency thermal cycling stress, shields chips and bonding gold wires, and provides integrated waterproof, insulation and anti-corrosion protection for continuous high-frequency operation.
Core Product Features & Advantages
Specially engineered for long-term high-frequency operation, it outperforms ordinary potting silicone in signal stability and durability:
1. Low high-frequency signal attenuation: Stable dielectric properties minimize signal loss, ensuring accurate and consistent transmission for RF and high-frequency circuits.
2. Comprehensive environmental resistance: Boasts excellent waterproof, dustproof, shockproof and anti-corrosion performance, with strong resistance to ozone and chemical erosion.
3. Extreme temperature adaptability: Operates steadily from -60℃ to 220℃, relieves thermal stress generated by frequent high-frequency operation to prevent component damage.
4. Low volatility & high bonding strength: Ultra-low volatile content and high structural stability, tightly bonding multiple substrates without performance fluctuation during high-frequency cycling.
Application Scenarios
Perfect for encapsulation and sealing of high-frequency communication modules, RF devices, high-speed circuit boards and wireless sensing electronics. Widely used in 5G communications, intelligent wireless devices and high-frequency industrial control systems. It stabilizes high-frequency signal transmission, reduces device failure rates caused by signal attenuation and thermal fatigue, and effectively lowers manufacturers’ production and after-sales costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly to ensure formula uniformity.
2. Standard mixing: Strictly follow the AB component weight ratio to maintain stable high-frequency dielectric performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3-minute defoaming to eliminate bubbles that interfere with high-frequency signals.
4. Curing treatment: Adopt room temperature or heating curing. Initial curing allows subsequent processing, with full curing completed within 24 hours.
Certifications & Compliance
All products pass ISO9001, CE, UL and ROHS certifications. Meeting international high-frequency electronic industry standards, these high-stability silicone materials support global export and high-end industrial applications.
Customization Options
Customized solutions are available. Viscosity, hardness, operating time and curing speed can be adjusted to adapt to different high-frequency device packaging and operating environments.
Production & Quality Control
We implement standardized production and full-process quality control. Pre-production sample testing and pre-shipment full inspection guarantee stable high-frequency performance and consistent batch quality.
FAQ
Q1: Will this potting silicone interfere with high-frequency signal transmission? A: No. It features ultra-low dielectric loss and stable high-frequency performance, causing no signal attenuation or distortion.
Q2: Does colloidal stratification affect high-frequency operating performance? A: Slight stratification is normal after long storage. Even stirring restores original performance with no impact on high-frequency stability.
Q3: What is the correct storage method? A: Keep sealed and dry. Mixed AB silicone should be used up at one time to avoid performance degradation.