Product Overview
Available in addition and condensation curing grades, this industrial-grade Electronic Potting Compound is optimized for harsh corrosive working environments. As a functionalElectronic Encapsulation Adhesive, it provides excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. This robust Silicone Encapsulant inherits outstanding heat dissipation properties of standard Thermally Conductive Potting Compound, integrating thermal management and full-range anti-corrosion protection. Technical Specifications
This anti corrosive module potting silicone features dense cured structure and superior chemical resistance. It resists ozone erosion, oxidation and various corrosive chemicals, effectively preventing metal rusting and circuit aging. It buffers internal stress caused by extreme temperature changes to avoid cracking and peeling. With low volatile content and high mechanical strength, it maintains long-term stable sealing performance with customizable viscosity, hardness and operating time.
Product Features & Advantages
1. Powerful Anti-Corrosion Performance: This rust proof protective encapsulation material forms a dense isolation layer to block corrosive media and prevent metal rusting.
2. Reliable Metal Protection: Provides professional metal surface circuit board sealing protection for all metal electronic components and contacts.
3. Harsh Environment Adaptability: The anti corrosive module potting silicone withstands humid, oxidative and chemically corrosive industrial scenarios.
4. Multi-Functional Integration: Combines waterproof, insulation, shockproof and temperature-resistant performance without compromising anti-corrosion capacity.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A evenly and shake component B thoroughly to uniformly disperse anti-corrosion functional fillers.
2. Standard Proportioning: Mix A and B components strictly by fixed weight ratio to ensure complete curing and intact protective structure.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless sealing.
4. Curing Procedure: Support room temperature or heating curing; full 24-hour curing forms a permanent anti-corrosion protective layer.
Application Scenarios
This corrosion-resistant compound is widely used in industrial metal circuit modules, marine electronic equipment, chemical plant control circuits and outdoor metal-based electronics. It greatly reduces circuit corrosion and metal rust failure rates, extends equipment service life and cuts long-term maintenance and replacement costs for manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic safety and environmental regulations.
Customization Options
We support personalized adjustment of cured hardness, viscosity and operating time to match diverse corrosive environment application demands.
Production Process
We adopt standardized dust-free production and strict anti-corrosion aging tests. Each batch undergoes professional corrosion simulation tests to guarantee stable long-term protection performance.
FAQ
Q1: What is the core advantage of this potting compound?
A: It is a premium rust proof protective encapsulation material and anti corrosive module potting silicone,
providing long-lasting metal surface circuit board sealing protection.
Q2: Can it protect metal circuits in humid and salty environments?
A: Yes. Its dense cured layer effectively isolates moisture and corrosive ions, preventing metal oxidation
and circuit corrosion in harsh environments.
Q3: Does colloidal stratification affect anti-corrosion performance?
A: Colloid stratification is a normal storage phenomenon. Stir evenly before use, and the original
anti-corrosion and sealing performance remains stable.