Product Overview
This two-component black pigmented silicone potting material includes addition and condensation curing types. It cures from liquid colloid into a solid opaque protective layer, dedicated to electronic component sealing, filling and pressure resistance. It delivers excellent adhesion and thermal stability on PCB, CPU, PC and PMMA materials, effectively blocking UV rays and ambient light interference while protecting internal chips and bonding wires from environmental damage.
Technical Specifications
Featuring ultra-high light and UV shielding performance, this dark colored module potting compound achieves full opaque encapsulation with zero light transmission. It has low volatile content, high structural strength and outstanding resistance to ozone and chemical erosion. It absorbs thermal cycling stress in high and low temperature environments, with stable insulation, heat dissipation and shockproof performance. Hardness, viscosity and operating time support customized adjustment.
Product Features & Advantages
1. Professional Light Blocking Performance: As a premium light blocking opaque encapsulation material, it completely avoids light-induced circuit aging and signal interference.
2. Reliable UV Shielding: This UV shielding circuit protection silicone resists long-term ultraviolet erosion, extending outdoor electronic device service life.
3. All-Round Environmental Protection: Integrates waterproof, dustproof, anti-corrosion, insulating and heat-conducting functions with wide temperature adaptability.
4. Superior Substrate Bonding: Firmly adheres to aluminum, copper, stainless steel and circuit boards, preventing peeling and failure in long-term operation.
Step-by-Step Usage Process
1. Pre-Mixing Preparation: Fully stir component A to homogenize settled fillers and shake component B thoroughly before use.
2. Accurate Proportioning: Mix A and B components strictly according to standard weight ratio to ensure complete curing and stable shielding performance.
3. Vacuum Defoaming: Stir the mixed compound evenly and defoam for 3 minutes under 0.01MPa vacuum to achieve bubble-free encapsulation.
4. Curing Treatment: Cure at room temperature or heating condition; full curing takes 24 hours, with temperature and humidity affecting curing speed.
Application Scenarios & Commercial Value
Ideal for optical electronics, photosensitive circuit modules, outdoor sensing equipment and precision electronic devices requiring light shading and UV resistance. It eliminates light interference and UV aging faults, improves product stability and yield, and reduces long-term equipment maintenance and replacement costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global electronic manufacturing safety and environmental requirements.
Customization Options
We support personalized customization of colloid viscosity, curing hardness and operating time to adapt to different photosensitive electronic encapsulation demands.
Production Process
Adopting high-purity raw materials and standardized production, each batch undergoes strict light shielding, UV resistance and stability tests to ensure consistent industrial-grade quality.
FAQ
Q1: What is the core advantage of this black potting compound?
A: It is a light blocking opaque encapsulation material and UV shielding circuit protection silicone, specially
designed for photosensitive electronic modules against light and UV damage.
Q2: Will the black pigment affect thermal conductivity and insulation?
A: No. The optimized pigment formula maintains original excellent heat dissipation and insulation performance
without compromising core protection functions.
Q3: Is colloidal stratification normal after long storage?
A: Yes. Even stirring before use can restore full performance, with no impact on light shielding and circuit
protection effects.