HONG YE SILICONE’s Rigid Electronic Potting Silicone is a high-strength structural hard shell module potting material, designed to form a sturdy firm solid protective encapsulation layer for electronic circuits. As a professional structural strength circuit protection compound, it delivers outstanding pressure resistance and anti-collision performance. It supports stable operation from -60℃ to 220℃, with insulation, heat dissipation and anti-corrosion properties. Our brand also supplies classic Electronic Potting Compound and high-performance Thermally Conductive Potting Compound to cover diverse electronic protection demands.
Product Overview
This rigid curing Silicone Encapsulant is a two-component industrial potting material, available in addition and condensation curing types. Serving as a high-hardness Electronic Encapsulation Adhesive, it is specially formulated for scenarios requiring strong structural support. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and various metal substrates, providing rigid integral protection different from flexible soft potting silicone. Technical Specifications
This structural strength circuit protection compound boasts ultra-high curing hardness and mechanical strength, effectively resisting external pressure, impact and extrusion damage. It has low volatile content and excellent ozone & chemical erosion resistance. It absorbs thermal cycling internal stress to protect chips and bonding wires, maintaining stable rigid structure in extreme temperature environments. Hardness, viscosity and operating time support personalized customization.
Product Features & Advantages
1. High Rigid Structural Protection: Forms a durable firm solid protective encapsulation layer to prevent circuit deformation and damage caused by external force extrusion.
2. Super Mechanical Resistance: As a premium hard shell module potting material, it outperforms flexible silicone in pressure resistance and impact resistance.
3. All-Round Barrier Performance: Integrates waterproof, dustproof, insulated, high-temperature resistant and anti-corrosion multi-protection functions.
4. Strong Universal Adhesion: Firmly bonds with aluminum, copper, stainless steel and circuit board materials without peeling off after long-term use.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A evenly and shake component B thoroughly to disperse internal functional fillers uniformly.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure complete rigid curing effect.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Standard Curing: Adopt room temperature or heating curing; full 24-hour curing forms a complete rigid protective shell.
Application Scenarios & Commercial Value
Widely applied in industrial control modules, heavy-duty electronic equipment, impact-prone circuit devices and high-load electronic components. Its rigid structural protection greatly reduces mechanical damage failure rates, extends equipment service life, and cuts long-term maintenance and replacement costs for manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic manufacturing safety and environmental regulations.
Customization Options
We support customized curing hardness, viscosity and operating time to match different structural protection and packaging process requirements.
Production Process
We adopt standardized dust-free production and strict structural strength testing. Each batch undergoes hardness and pressure resistance tests to ensure stable rigid protection performance.
FAQ
Q1: What is the biggest difference between rigid and soft potting silicone?
A: This rigid electronic potting silicone forms a hard shell after curing, providing strong structural support and
anti-pressure protection that soft silicone cannot achieve.
Q2: Is it suitable for high-temperature working environments?
A: Yes. It maintains stable rigid structure and protection performance in the temperature range of -60℃ to
220℃ with excellent thermal stability.
Q3: Will colloidal stratification affect curing hardness?
A: Stratification is a normal storage phenomenon. Even stirring before use will not change its rigid curing
performance and structural strength.
Shenzhen Hong Ye Jie Technology Co., Ltd
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