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Home> Products> Electronic Potting Compound> Gap Filling Electronic Potting Compound
Gap Filling Electronic Potting Compound
Gap Filling Electronic Potting Compound
Gap Filling Electronic Potting Compound
Gap Filling Electronic Potting Compound
Gap Filling Electronic Potting Compound
Gap Filling Electronic Potting Compound

Gap Filling Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-215

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-4
Product Description
HONG YE SILICONE’s Gap Filling Electronic Potting Compound is a professional void filling protective encapsulation material tailored for compact electronic modules. As a high-precision air pocket removal module potting silicone and tight space circuit sealing compound, it eliminates internal gaps and bubbles. It operates stably at -60℃ to 220℃, integrating insulation, heat dissipation and waterproof protection. Complementary to our core lineup including standard Electronic Potting Compound and Thermally Conductive Potting Compound, it solves sealing challenges for miniaturized circuit equipment.
 
package3

Product Overview

Available in addition and condensation curing formulas, this premium Gap Filling Electronic Potting Compound is a low-viscosity Silicone Encapsulant for precision gap sealing. It serves as a high-performance Electronic Encapsulation Adhesive, delivering excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple metal substrates. It perfectly fills tiny gaps inside compact electronic components, realizing full coverage protection that ordinary potting materials cannot achieve.

Technical Specifications

This tight space circuit sealing compound features ultra-low viscosity and superior fluidity for seamless penetration into micro gaps. It effectively removes air pockets to achieve void-free encapsulation, with low volatile content and high structural strength. Boasting excellent ozone and chemical erosion resistance, it absorbs thermal cycling stress to protect chips and bonding wires. Hardness, viscosity and operating time support full customization for diverse compact packaging demands.
 
electronic silicone

Product Features & Advantages

1. Precision Gap Filling: This void filling protective encapsulation material fully fills tiny internal gaps to avoid hollow protection and local circuit failure.
2. Air Pocket Elimination: As professional air pocket removal module potting silicone, it realizes bubble-free encapsulation for long-term stable circuit operation.
3. Multi-Performance Integration: Combines waterproof, dustproof, insulated, shockproof and anti-corrosion functions with stable wide-temperature tolerance.
4. Universal Substrate Adhesion: Firmly bonds with PCB, plastic and various metal materials to form an integrated tight protective layer.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A and shake component B thoroughly to evenly disperse functional fillers.
2. Standard Proportioning: Mix A and B components strictly by fixed weight ratio to ensure complete curing and filling performance.
3. Vacuum Defoaming: Place mixed compound in 0.01MPa vacuum environment for 3 minutes to remove residual air bubbles for precise filling.
4. Curing Procedure: Adopt room temperature or heating curing; full 24-hour curing forms a complete gap-filling protective layer.

Application Scenarios & Product Value

Ideal for miniaturized sensors, compact control modules, precision circuit boards and narrow-gap electronic equipment. It eliminates hidden dangers of gap moisture and dust accumulation, reduces equipment failure rates, extends component service life, and lowers long-term maintenance costs for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global precision electronic manufacturing safety specifications.

Customization Options

We support personalized adjustment of hardness, viscosity and operating time to adapt to different narrow-gap encapsulation scenarios.

Production Process

We adopt standardized dust-free production and strict gap-filling simulation tests. Each batch undergoes fluidity and void-free testing to guarantee stable precision sealing performance.

FAQ

Q1: What is the core advantage of this potting compound?
A: It is a void filling protective encapsulation material and air pocket removal module potting silicone,
specially designed for tight space circuit sealing and gap-free protection.
Q2: Can it fill ultra-tiny internal gaps of precision electronics?
A: Yes. Ultra-low viscosity formula provides excellent fluidity, which can penetrate and fill micro gaps that
ordinary potting glue cannot cover.
Q3: Does colloidal stratification affect filling performance?
A: Stratification is a normal storage phenomenon. Stir evenly before use, and the gap-filling and sealing
performance remains completely stable.
 
 
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