Product Overview
This two-component deep black silicone potting material is available in addition and condensation curing types. The liquid colloid cures into a solid opaque protective layer, dedicated to encapsulation, sealing, filling and pressure resistance of precision electronic components. It features excellent adhesion and thermal stability for PCB, CPU, PC and PMMA substrates, effectively blocking ambient light and ultraviolet radiation to protect internal chips and bonding wires from photoaging and signal interference.
Technical Specifications
This dark pigment module potting compound achieves 100% light shading with zero light transmission, providing long-term UV blocking performance. It owns low volatile content, high structural strength and outstanding resistance to ozone and chemical corrosion. It effectively absorbs thermal cycling stress to avoid cracking and peeling, with stable insulation, shockproof and heat-conducting properties. Viscosity, hardness and operating time are fully customizable for personalized packaging processes.
Product Features & Advantages
1. Ultra-High Shading Performance: As an advanced opaque light shielding encapsulation material, it completely eliminates light interference and photo-induced circuit aging.
2. Reliable UV Protection: This UV blocking circuit protection silicone resists long-term ultraviolet erosion, ideal for outdoor and photosensitive electronic equipment.
3. All-Round Environmental Resistance: Integrates waterproof, dustproof, anti-corrosion and high-low temperature resistant functions for full-circuit protection.
4. Superior Structural Stability: Firmly bonds with various metals and plastic substrates, maintaining stable performance during long-term temperature cycling operation.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure complete curing and stable shading performance.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless encapsulation.
4. Standard Curing: Cure at room temperature or heated condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Perfect for photosensitive sensors, optical electronic modules, outdoor industrial electronics and precision devices requiring light shielding. It reduces photoaging failure rates, improves product stability and finished product yield, and cuts long-term maintenance and replacement costs for electronic manufacturers.
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global precision electronic manufacturing safety and environmental specifications.
Customization Options
We support customized viscosity, curing hardness and operating time to adapt to different light shielding requirements and packaging process standards.
Production Process
Adopting high-purity raw materials and standardized dust-free production, each batch undergoes strict light shielding, UV resistance and stability tests to ensure consistent industrial-grade quality.
FAQ
Q1: What makes this deep black potting compound different from ordinary black silicone?
A: It adopts high-concentration dark pigment formula, achieving ultra-high opaque shading and stronger
UV blocking ability for high-precision photosensitive electronics.
Q2: Will the dark pigment affect thermal and insulating performance?
A: No. The optimized formula retains excellent heat dissipation and insulation properties without
compromising core electronic protection functions.
Q3: How to store the liquid potting compound?
A: Keep sealed and stored in a dry room-temperature environment. Stir evenly if colloidal stratification
occurs, which will not affect product performance.