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Home> Products> Electronic Potting Compound> Sag Resistant Electronic Potting Compound
Sag Resistant Electronic Potting Compound
Sag Resistant Electronic Potting Compound
Sag Resistant Electronic Potting Compound
Sag Resistant Electronic Potting Compound
Sag Resistant Electronic Potting Compound
Sag Resistant Electronic Potting Compound

Sag Resistant Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9055

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s Sag Resistant Electronic Potting Compound is a premium non slump protective encapsulation material and reliable vertical hold module Potting Compound. Designed as professionalthick section circuit protection silicone, it features anti-sag performance for vertical and overhead encapsulation. It stably operates at -60℃ to 220℃ with full waterproof, insulation and heat dissipation. It matches our full product line: standard Electronic potting compound, heat-conductive Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
package3

Product Overview

This two-component sag-resistant silicone potting material includes addition and condensation curing formulas. Optimized with anti-slump rheology, it solves sagging and flowing defects of ordinary potting glue on vertical, inclined and overhead electronic modules. It delivers excellent adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates. It effectively absorbs thermal cycling stress, protecting chips and bonding wires with low volatility and high structural strength.

Technical Specifications

As dedicated thick section circuit protection silicone, it features outstanding vertical hold ability without sagging or dripping during curing. It has low volatile content, high bonding strength and excellent resistance to ozone and chemical erosion. It maintains stable insulation, shockproof and temperature-resistant performance in extreme working conditions. Viscosity, curing hardness and operating time support full personalized customization.
 
electronic silicone

Product Features & Advantages

1. Superior Anti-Sag Performance: This non slump protective encapsulation material keeps intact thick coating on vertical and overhead module surfaces.
2. Stable Vertical Encapsulation: The vertical hold module potting compound ensures uniform filling and molding for special-angle electronic structures.
3. All-Round Durable Protection: Integrates waterproof, dustproof, anti-corrosion and wide-temperature resistant functions to adapt to complex environments.
4. High Structural Stability: Firmly bonds with multiple substrates, absorbs thermal stress effectively and avoids cracking or peeling failure.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable sag-resistant performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes for bubble-free encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for vertical-mounted circuit modules, overhead electronic components and special-angle industrial electronics. Its anti-sag property eliminates coating unevenness and material waste, improves encapsulation yield and product appearance consistency, and reduces post-maintenance costs for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic manufacturing specifications.

Customization Options

We support customized viscosity, curing hardness and operating time to adapt to diverse vertical and thick-section encapsulation processes.

Production Process

Adopting anti-sag formula and standardized dust-free production, each batch undergoes strict vertical molding and stability tests to guarantee consistent premium quality.

FAQ

Q1: What is the core advantage of sag-resistant potting compound?
A: It is a non slump protective encapsulation material with excellent vertical hold performance, suitable for
special-angle module encapsulation.
Q2: Will high-temperature curing cause sagging deformation?
A: No. The optimized rheological formula maintains stable molding effect without dripping or sagging
during curing.
Q3: Does stored colloidal stratification affect anti-sag performance?
A: No. Stir evenly before use, and it can fully restore stable vertical encapsulation and thick-section
protection performance.
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