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Home> Products> Electronic Potting Compound> Self Leveling Electronic Potting Compound
Self Leveling Electronic Potting Compound
Self Leveling Electronic Potting Compound
Self Leveling Electronic Potting Compound
Self Leveling Electronic Potting Compound
Self Leveling Electronic Potting Compound
Self Leveling Electronic Potting Compound

Self Leveling Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9305

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE’s Self Leveling Electronic Potting Compound is a premium even spread module Potting Compound and flat finish protective encapsulation material. As a high-fluidity smooth surface circuit protection silicone, it features automatic leveling without manual smoothing. It delivers stable protection from -60℃ to 220℃ with insulation, waterproof and heat dissipation performance. It complements our full lineup: standard Electronic potting compound, thermal-conductive Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and durable Silicone Encapsulant.
 
HY-factory

Product Overview

This two-component self-leveling silicone potting material includes addition and condensation curing formulas. Featured with excellent fluidity and automatic leveling capability, it solves uneven coating and gap filling defects of traditional potting glue. It offers outstanding adhesion and thermal stability on PCB, CPU, PC and PMMA substrates. It effectively absorbs thermal cycling stress to protect chips and bonding wires, with ultra-low volatility and high overall structural stability.

Technical Specifications

This smooth surface circuit protection silicone boasts superior self-leveling and even-spread properties for flat, flawless encapsulation surfaces. It features excellent ozone and chemical erosion resistance, stable wide-temperature performance and integrated waterproof, dustproof and shockproof functions. It bonds firmly with aluminum, copper and stainless steel. Viscosity, curing hardness and operating time support full personalized customization.
 
electronic silicone

Product Features & Advantages

1. Automatic Leveling Performance: This even spread module potting compound spreads evenly by itself, eliminating manual leveling work.
2. Flawless Flat Finish: The flat finish protective encapsulation material forms smooth, uniform coating without bulges or uneven areas.
3. All-Round Environmental Resistance: Resists extreme temperatures, corrosion and moisture, ensuring long-term stable circuit operation.
4. High Purity & Stability: Low volatile content avoids component contamination, suitable for precision electronic encapsulation.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable self-leveling performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to achieve bubble-free flat encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for flat PCB boards, precision circuit modules, LED modules and automated batch production electronics. Its self-leveling feature simplifies construction processes, reduces labor costs and surface defect rates, improves finished product consistency and appearance quality, and effectively boosts manufacturers’ production efficiency and product competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global electronic manufacturing safety and environmental requirements.

Customization Options

We support customized viscosity, curing hardness and operating time to adapt to different flat module encapsulation processes.

Production Process

Adopting high-fluidity self-leveling formula and standardized dust-free production, each batch undergoes strict flatness and performance tests to ensure consistent high-quality encapsulation effects.

FAQ

Q1: What is the core advantage of self-leveling potting compound?
A: It is an even spread module potting compound with automatic flat molding, saving labor and ensuring
uniform encapsulation surfaces.
Q2: Can it achieve completely flat curing effect?
A: Yes. As dedicated flat finish protective encapsulation material, it naturally levels out to form a smooth
and flawless protective layer.
Q3: Will colloidal stratification affect leveling performance?
A: No. Stir evenly before use, and it can fully restore stable self-leveling and smooth surface protection
performance.
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