HONG YE SILICONE’s High Build Black Electronic Potting Silicone is a professional Black Silicone Potting for Electronics featuring thick-layer molding performance. It forms a dense thick section opaque encapsulation layer to realize reliable Circuit Protection with Black Silicone. Supporting -60℃ to 220℃ continuous operation, it integrates shading, insulation and anti-aging functions. It matches our core product series: standard Electronic Potting Compound, high-efficiency Thermally Conductive Potting Compound, versatile Electronic Encapsulation Adhesive and durable Silicone Encapsulant.
Product Overview
This two-component high-build black silicone potting material includes addition and condensation curing types. It is specially formulated for thick-section encapsulation and light-shielding protection of electronic components. With excellent filling and covering ability, it delivers outstanding adhesion and thermal stability on PCB, CPU, PC, PMMA and multiple metal substrates. It effectively absorbs thermal cycling internal stress, protects chips and bonding wires, and features low volatility and high structural strength for long-term stable circuit protection.
Technical Specifications
This circuit protection black silicone features ultra-high build thickness molding capacity without hollowing or shrinkage. The thick section opaque encapsulation layer provides excellent light shielding, dustproof and anti-corrosion performance. It resists ozone and chemical erosion, maintains stable insulation and heat dissipation in extreme temperature ranges, and boasts strong bonding force on aluminum, copper and stainless steel. Viscosity, hardness and operating time support full personalized customization.
Product Features & Advantages
1. High-Build Thick Layer Molding: This Black Silicone Potting for Electronics supports one-time deep filling for large-gap and thick-module encapsulation.
2. Professional Opaque Shading: The thick section opaque encapsulation layer blocks light interference, ideal for light-sensitive electronic modules.
3. Extreme Environment Stability: Operates stably from -60℃ to 220℃, relieving thermal stress to avoid cracking and peeling failure.
4. Multi-Substrate Compatibility: Excellent adhesion and sealing performance on various plastics and metals with low volatile content and high toughness.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable thick-layer curing effect.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes for bubble-free dense encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Perfect for LED modules, light-sensitive sensors, industrial thick-layer circuit modules and outdoor electronic equipment. Its integrated shading and high-strength protection reduces light interference and environmental damage, lowers product failure rates, extends service life, and cuts long-term maintenance and replacement costs for electronic manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic manufacturing safety and environmental specifications.
Customization Options
We support personalized customization of curing hardness, viscosity and operating time to adapt to different thick-section encapsulation and light-shielding demands.
Production Process
Adopting high-purity black shading formula and standardized dust-free production, each batch undergoes strict thick-layer curing and stability tests to guarantee consistent premium protection quality.
FAQ
Q1: What are the unique strengths of high build black potting silicone?
A: It realizes thick-section deep filling and opaque light shielding, providing dual structural and anti-light
interference circuit protection.
Q2: Will thick-layer curing cause incomplete internal molding?
A: No. Optimized formula ensures uniform internal and external curing, forming a complete and stable
opaque protective layer.
Q3: Does colloidal stratification after storage affect performance?
A: No. Even stirring before use can fully restore its thick-layer molding, shading and circuit protection
performance.
Shenzhen Hong Ye Jie Technology Co., Ltd
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