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Home> Products> Electronic Potting Compound> High Bond Electronic Potting Silicone
High Bond Electronic Potting Silicone
High Bond Electronic Potting Silicone
High Bond Electronic Potting Silicone
High Bond Electronic Potting Silicone
High Bond Electronic Potting Silicone
High Bond Electronic Potting Silicone

High Bond Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9305

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
 
HONG YE SILICONE’s High Bond Electronic Potting Silicone is a high-adhesion strong adhesion protective encapsulation layer and upgraded enhanced grip module Potting Compound. As reliable secure component circuit protection material, it features superior bonding strength on metals and plastics. It operates stably from -60℃ to 220℃ with full insulation and anti-aging performance. It complements our full product lineup: standard Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
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Product Overview

This two-component high-bond silicone potting material includes addition and condensation curing formulas, optimized for ultra-strong adhesion encapsulation. It solves peeling and delamination issues of ordinary potting glue. It delivers exceptional sealing and pressure resistance for electronic components, with excellent thermal stability and gripping force on PCB, CPU, PC, PMMA, aluminum, copper and stainless steel. It absorbs thermal cycling stress effectively, firmly locking chips and bonding wires for long-term stable circuit protection.

Technical Specifications

This secure component circuit protection material features enhanced substrate gripping force and low volatile formula. It boasts outstanding ozone resistance, chemical erosion resistance and wide-temperature tolerance. It integrates waterproof, dustproof, shockproof and insulating functions. Viscosity, curing hardness and operating time support full personalized customization to fit diverse high-adhesion packaging requirements.

Product Features & Advantages

1. Ultra-Strong Bonding Performance: This strong adhesion protective encapsulation layer tightly bonds multiple substrates to avoid delamination in complex environments.
2. Enhanced Grip Stability: The enhanced grip module potting compound maintains stable adhesion under thermal cycling and vibration conditions.
3. All-Round Environmental Resistance: Resists extreme cold and heat, corrosion and moisture, ensuring durable component protection.
4. High Purity & High Toughness: Low volatile content prevents component contamination, while high structural strength improves overall module firmness.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain high-bond curing performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes for bubble-free tight encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
 
electronic silicone

Application Scenarios & Commercial Value

Ideal for vibration-prone automotive electronics, industrial control modules, metal-base circuit boards and high-stability precision equipment. Its high-bond performance eliminates encapsulation peeling failure, reduces product repair and replacement costs, improves structural stability and product durability, and enhances market competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic manufacturing safety and environmental specifications.

Customization Options

We support customized viscosity, curing hardness and operating time to adapt to different high-adhesion electronic encapsulation processes.

Production Process

Adopting high-adhesion upgraded formula and standardized dust-free production, each batch undergoes strict bonding strength and stability tests to guarantee consistent high-bond protection quality.

FAQ

Q1: What is the core advantage of high bond potting silicone?
A: It is an enhanced grip module potting compound with ultra-strong multi-substrate adhesion, preventing
encapsulation delamination and failure.
Q2: Is it suitable for vibration-intensive electronic equipment?
A: Yes. The strong adhesion protective encapsulation layer maintains stable bonding under long-term
vibration and temperature changes.
Q3: Does colloidal stratification affect bonding performance?
A: No. Stir evenly before use, and it can fully restore excellent adhesion and secure component
protection performance.
 
 
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