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Home> Products> Electronic Potting Compound> Semi Flex Electronic Potting Silicone
Semi Flex Electronic Potting Silicone
Semi Flex Electronic Potting Silicone
Semi Flex Electronic Potting Silicone
Semi Flex Electronic Potting Silicone
Semi Flex Electronic Potting Silicone
Semi Flex Electronic Potting Silicone

Semi Flex Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9020

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-4
Product Description
HONG YE SILICONE’s Semi Flex Electronic Potting Silicone is a balanced moderate flexibility protective encapsulation layer and professional balanced stiffness module Potting Compound. As premium mild stress circuit protection material, it balances rigidity and flexibility for diverse electronic packaging. It operates stably from -60℃ to 220℃ with full insulation and stress relief. It complements our full product lineup: standard Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
HY-company

Product Overview

This two-component semi-flex silicone potting material includes addition and condensation curing formulas, designed for balanced flexibility and stiffness encapsulation. It solves the drawbacks of overly rigid or overly soft potting glue, adapting to diverse electronic module requirements. It provides excellent encapsulation, sealing and pressure resistance for electronic components, with superior adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, effectively relieving internal stress while maintaining structural stability.

Technical Specifications

This mild stress circuit protection material features optimized semi-flexible formula with balanced mechanical properties. It boasts outstanding corrosion resistance, ozone resistance and chemical stability. It maintains stable waterproof, dustproof, insulating and shockproof performance in extreme working environments, with low volatility and strong bonding force. Viscosity, curing hardness and flexibility support full personalized customization.

Product Features & Advantages

1. Balanced Flexibility & Stiffness: This moderate flexibility protective encapsulation layer achieves ideal balance between rigidity and flexibility for universal electronic protection.
2. Mild Stress Relief: The balanced stiffness module potting compound effectively relieves thermal cycling stress without losing structural support.
3. All-Round Environmental Stability: Resists wide temperature fluctuations and harsh environments, ensuring long-term reliable circuit protection.
4. High Purity & Versatility: Low volatile content avoids component contamination, while semi-flexible structure adapts to diverse encapsulation scenarios.
 
electronic silicone

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable semi-flexible performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for uniform encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, with balanced semi-flexible performance fully developed after curing.

Application Scenarios & Commercial Value

Ideal for general industrial control modules, consumer electronics, LED equipment and electronic products requiring balanced protection. Its semi-flexible performance simplifies material selection, reduces process adjustment costs, improves product stability and adaptability, and lowers long-term maintenance and replacement costs for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global electronic manufacturing safety and environmental specifications.

Customization Options

We support personalized customization of viscosity, curing hardness and flexibility to adapt to diverse semi-flexible encapsulation processes.

Production Process

Adopting balanced semi-flexible formula and standardized dust-free production, each batch undergoes strict flexibility and stiffness tests to ensure consistent premium protective quality.

FAQ

Q1: What is the core advantage of semi-flex potting silicone?
A: It is a balanced stiffness module potting compound with moderate flexibility, balancing structural
support and stress relief.
Q2: Is it suitable for general electronic modules with diverse protection needs?
A: Yes. This moderate flexibility protective encapsulation layer adapts to most general electronic
encapsulation scenarios.
Q3: Does colloidal stratification affect semi-flexible performance?
A: No. Stir evenly before use, and it can fully restore balanced flexibility and mild stress circuit
protection performance.
 
 
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