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Home> Products> Electronic Potting Compound> Electronic Potting Compound for General Encapsulation
Electronic Potting Compound for General Encapsulation
Electronic Potting Compound for General Encapsulation
Electronic Potting Compound for General Encapsulation
Electronic Potting Compound for General Encapsulation
Electronic Potting Compound for General Encapsulation
Electronic Potting Compound for General Encapsulation

Electronic Potting Compound for General Encapsulation

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9035

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting
Product Description
HONG YE SILICONE’s Electronic Potting Compound for General Encapsulation is a versatile versatile protective covering material and cost-effective standard grade module Potting Compound. As premium reliable circuit board sealing silicone, it delivers all-round basic protection for general electronic encapsulation. It operates stably from -60℃ to 220℃ with full insulation and environmental resistance. It complements our full product lineup: standard Electronic potting compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
HY-SILICONE company

Product Overview

This two-component general-encapsulation silicone potting material includes addition and condensation curing formulas, designed for universal and cost-effective electronic protection. It meets the basic encapsulation needs of most general electronic products without excessive performance redundancy. It provides excellent encapsulation, sealing and filling protection for electronic components, with superior adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, suitable for wide-ranging general electronic packaging scenarios.

Technical Specifications

This reliable circuit board sealing silicone features balanced comprehensive performance and universal adaptability. It boasts outstanding corrosion resistance, ozone resistance and chemical stability. It maintains stable waterproof, dustproof, insulating and shockproof performance in general working environments, with low volatility and strong bonding force. Viscosity, curing hardness and operating time support full personalized customization.
 
electronic silicone

Product Features & Advantages

1. Versatile Universal Protection: This versatile protective covering material meets diverse basic encapsulation needs of general electronic products with balanced performance.
2. Cost-Effective Standard Grade: The standard grade module potting compound provides reliable protection at a reasonable cost, ideal for mass general electronic production.
3. All-Round Environmental Stability: Resists wide temperature fluctuations and daily harsh environments, ensuring long-term reliable circuit protection.
4. High Purity & Easy Operation: Low volatile content avoids component contamination, while simple operation reduces production difficulty and cost.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable general encapsulation performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for uniform encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, with complete general encapsulation protection fully formed after curing.

Application Scenarios & Commercial Value

Ideal for general industrial control modules, consumer electronics, LED lighting equipment and most standard electronic products. Its cost-effective and versatile performance reduces material procurement costs, simplifies production processes, improves product qualification rate, and lowers long-term maintenance and replacement costs for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental specifications.

Customization Options

We support personalized customization of viscosity, curing hardness and operating time to adapt to diverse general encapsulation processes.

Production Process

Adopting standard general-purpose formula and standardized dust-free production, each batch undergoes strict performance tests to ensure consistent premium protective quality.

FAQ

Q1: What is the core advantage of general-encapsulation potting silicone?
A: It is a standard grade module potting compound with versatile performance and high cost-effectiveness
for general electronic encapsulation.
Q2: Is it suitable for mass production of general electronic products?
A: Yes. This versatile protective covering material features easy operation and stable performance, fitting
mass production processes perfectly.
Q3: Does colloidal stratification affect general encapsulation performance?
A: No. Stir evenly before use, and it can fully restore stable performance and reliable circuit board sealing
effect.
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