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Home> Products> Electronic Potting Compound> Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation

Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation

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Product Description
Product Description

Hong Ye Silicone HY-9 Series Electronic Potting Silicone is a two-component addition-cure (platinum-cure) silicone gel designed for electronic potting, sealing, encapsulation and protection. It cures at room temperature or with heat acceleration, forming a soft, transparent, self-adhesive gel that provides excellent insulation, waterproofing, shock absorption and thermal management for sensitive electronic components.
 
Key Features

Self-Adhesive Without Primer: Bonds directly to most substrates including PC, PP, ABS, PVC and metals, saving processing time and cost
Ultra-Low Viscosity: Flows effortlessly into tight spaces and around delicate components for void-free encapsulation
1:1 Mixing Ratio: Simple weight-based mixing reduces errors and ensures consistent curing
Flexible Curing: Room temperature cure (8h at 25°C) or rapid heat cure (20min at 80°C) to match your production schedule
Superior Insulation: Dielectric strength no less than 25 kV/mm protects sensitive electronics from voltage breakdown
Waterproof and Moisture-Proof: Forms a seamless gel barrier that prevents water ingress and corrosion
Thermal Management: Thermal conductivity no less than 0.2 W/(m.K) helps maintain safe operating temperatures
UL94 V-1 Flame Retardant: Meets international safety standards for electronic applications
Long-Term Stability: Performs reliably from -50°C to 200°C, ideal for demanding environments
 
Available Models
 
Model: HY-9300, Hardness: 0 Shore A, Mixed Viscosity: 600-1000 cps, Operating Time: 30-60 min (25°C), Curing Time: 8h (25°C), Best For: Self-adhesive gel potting, transparent encapsulation

Model: HY-9400, Hardness: less than 0 Shore A, Mixed Viscosity: 680-1400 cps, Operating Time: 40-60 min (25°C), Curing Time: 3-5h (25°C), Best For: Ultra-soft gel filling, deep layer potting

Model: HY-9405, Hardness: 5 plus or minus 2 Shore A, Mixed Viscosity: 600-1000 cps, Operating Time: 1-3h (25°C), Curing Time: 8h (25°C), Best For: General electronic potting, slightly firmer gel

Custom formulations available upon request. Hardness, viscosity, curing speed and color can all be tailored.
 
How to Use
  1. Stir component A and B separately before mixing
  2. Measure A and B at 1:1 by weight
  3. Blend thoroughly until homogeneous
  4. Vacuum at -0.08 MPa for 3-5 minutes to remove air bubbles
  5. Fill into the target area or component
  6. Cure at room temperature or accelerate with heat (80-100°C)
Applications
 
LED outdoor display potting and waterproof protection
PCB board moisture-proof sealing
Power supply module encapsulation
Sensor and probe potting
Cable and connector sealing
Transformer and inductor potting
Underwater electronics protection
Automotive electronic module encapsulation

Packing and Delivery

Standard: 20kg/set (Component A 10kg + Component B 10kg)
Bulk: 200kg drum available
Custom packaging upon request
Non-dangerous goods classification for easy shipping
Store at 25°C or below, shelf life 12 months

Why Choose Hong Ye Silicone

25+ years specialized in silicone R&D and manufacturing
ISO9001 certified factory with strict quality control
In-house R&D team for custom solutions
Exported to 138+ countries, trusted by global buyers
Free samples for quality verification
Fast response and full technical support
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FAQ
 
Q: What substrates does the gel bond to?
A: The self-adhesive formula bonds well to PC, PP, ABS, PVC and common metals without primer. For other substrates, contact us for compatibility testing.
 
Q: Can I cure it at room temperature?
A: Yes. At 25°C it fully cures in approximately 8 hours. For faster production, heat cure at 80-100°C takes only 20 minutes.
 
Q: What is the minimum order?
A: Standard MOQ is 20kg (1 set). Sample quantities from 1kg are available for testing.
 
Q: Is it safe for outdoor LED displays?
A: Absolutely. The cured gel is waterproof, UV resistant and performs from -50°C to 200°C, making it ideal for outdoor LED applications.
 
Q: Can you customize the product?
A: Yes. We can adjust hardness, viscosity, color, curing speed and other parameters to suit your specific application.
 
 
 
 
 
Home> Products> Electronic Potting Compound> Two Component Addition Cure Electronic Potting Silicone Rubber for PCB Board Sealing and Encapsulation
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