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Home> Products> Electronic Potting Compound> Standard Viscosity Electronic Potting Compound
Standard Viscosity Electronic Potting Compound
Standard Viscosity Electronic Potting Compound
Standard Viscosity Electronic Potting Compound
Standard Viscosity Electronic Potting Compound
Standard Viscosity Electronic Potting Compound
Standard Viscosity Electronic Potting Compound

Standard Viscosity Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9030

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE’s Standard Viscosity Electronic Potting Compound is a universal standard viscosity silicone potting material and reliable medium pour module Potting Compound. As premium general fill circuit protection silicone, it features balanced viscosity for universal electronic encapsulation. It operates stably from -60℃ to 220℃ with full insulation and environmental resistance. It complements our full product lineup: standard Electronic potting compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
package3

Product Overview

This two-component standard-viscosity silicone potting material includes addition and condensation curing formulas, designed for universal and easy-to-operate electronic encapsulation. It solves the problems of difficult pouring and uneven filling caused by too high or too low viscosity of ordinary potting glue. It provides excellent encapsulation, sealing and filling protection for general electronic components, with superior adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, suitable for most standard electronic packaging scenarios.

Technical Specifications

This general fill circuit protection silicone features standard balanced viscosity and stable medium-pour performance. It boasts outstanding corrosion resistance, ozone resistance and chemical stability. It maintains stable waterproof, dustproof, insulating and shockproof performance in extreme working environments, with low volatility and strong bonding force. Viscosity, curing hardness and operating time support full personalized customization.

Product Features & Advantages

1. Balanced Standard Viscosity: This standard viscosity silicone potting material features moderate fluidity, ensuring smooth pouring and easy operation for most standard processes.
2. Reliable General Filling: The medium pour module potting compound realizes uniform filling without dead angles, adapting to diverse general electronic modules.
3. All-Round Environmental Stability: Resists wide temperature fluctuations and harsh environments, ensuring long-term reliable circuit protection.
4. High Purity & Versatility: Low volatile content avoids component contamination, while standard viscosity simplifies production operation and reduces process adjustment costs.
 
electronic silicone

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable standard viscosity performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for uniform filling.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, with complete general fill protection fully formed after curing.

Application Scenarios & Commercial Value

Ideal for general industrial control modules, consumer electronics, LED equipment and most standard electronic packaging. Its standard viscosity performance simplifies material selection and production operation, improves production efficiency and product consistency, reduces rework and maintenance costs, and enhances core competitiveness for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental specifications.

Customization Options

We support personalized customization of viscosity, curing hardness and operating time to adapt to diverse standard encapsulation processes.

Production Process

Adopting standard viscosity formula and standardized dust-free production, each batch undergoes strict viscosity and filling tests to ensure consistent premium protective quality.

FAQ

Q1: What is the core advantage of standard-viscosity potting silicone?
A: It is a medium pour module potting compound with balanced standard viscosity, suitable for most
general electronic encapsulation scenarios.
Q2: Is it easy to operate for mass production?
A: Yes. This standard viscosity silicone potting material features smooth pouring and simple operation,
fitting mass production processes perfectly.
Q3: Does colloidal stratification affect standard viscosity performance?
A: No. Stir evenly before use, and it can fully restore stable viscosity and general fill circuit protection
performance.
 
 
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