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Home> Products> Electronic Potting Compound> Standard Flow Electronic Potting Compound
Standard Flow Electronic Potting Compound
Standard Flow Electronic Potting Compound
Standard Flow Electronic Potting Compound
Standard Flow Electronic Potting Compound
Standard Flow Electronic Potting Compound
Standard Flow Electronic Potting Compound

Standard Flow Electronic Potting Compound

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9025

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-5
Product Description
HONG YE SILICONE’s Standard Flow Electronic Potting Compound is a universal moderate viscosity protective encapsulation material and reliable consistent pour module potting. As premium uniform fill circuit protection silicone, it features stable flowability for standard electronic encapsulation. It operates stably from -60℃ to 220℃ with full insulation and environmental resistance. It complements our full product lineup: standard Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
package2

Product Overview

This two-component standard-flow silicone potting material includes addition and condensation curing formulas, designed for universal and consistent electronic encapsulation. It solves flow instability and uneven filling issues of ordinary potting glue. It provides excellent encapsulation, sealing and filling protection for general electronic components, with superior adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, ensuring uniform filling for standard electronic modules.

Technical Specifications

This uniform fill circuit protection silicone features moderate viscosity and stable flow performance for standard encapsulation processes. It boasts outstanding corrosion resistance, ozone resistance and chemical stability. It maintains stable waterproof, dustproof, insulating and shockproof performance in extreme working environments, with low volatility and strong bonding force. Viscosity, curing hardness and operating time support full personalized customization.
 
electronic silicone

Product Features & Advantages

1. Standard Stable Flow: This moderate viscosity protective encapsulation material features consistent pouring performance, suitable for most standard electronic encapsulation processes.
2. Uniform Filling Effect: The consistent pour module potting ensures even filling without dead angles or uneven thickness in standard electronic modules.
3. All-Round Environmental Stability: Resists wide temperature fluctuations and harsh environments, ensuring long-term reliable circuit protection.
4. High Purity & Versatility: Low volatile content avoids component contamination, while standard flowability simplifies production operation.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable standard flow performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for uniform filling.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, with uniform fill protection fully formed after curing.

Application Scenarios & Commercial Value

Ideal for general industrial control modules, consumer electronics, LED equipment and standard electronic packaging. Its standard flow performance simplifies process operation, reduces production adjustment costs, improves production efficiency and product consistency, and lowers long-term maintenance and replacement costs for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global general electronic manufacturing safety and environmental specifications.

Customization Options

We support personalized customization of viscosity, curing hardness and operating time to adapt to diverse standard encapsulation processes.

Production Process

Adopting standard flow formula and standardized dust-free production, each batch undergoes strict flow and filling tests to ensure consistent premium protective quality.

FAQ

Q1: What is the core advantage of standard-flow potting silicone?
A: It is a consistent pour module potting with moderate viscosity, ensuring stable flow and uniform
filling for standard electronic modules.
Q2: Is it suitable for general standard electronic encapsulation scenarios?
A: Yes. This moderate viscosity protective encapsulation material fits most standard electronic
packaging processes perfectly.
Q3: Does colloidal stratification affect standard flow performance?
A: No. Stir evenly before use, and it can fully restore stable flow and uniform fill circuit protection
performance.
 
 
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