Product Overview
This two-component shock-proof silicone potting material includes addition and condensation curing formulas, specially engineered for impact and vibration protection. It solves damage risks of electronic components caused by mechanical shock and drop impacts. It provides superior encapsulation, sealing and buffering protection for electronic components, with excellent adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, effectively absorbing external shock and internal thermal stress.
Technical Specifications
This mechanical shock circuit protection material features high toughness and excellent shock absorption performance. It boasts outstanding corrosion resistance, ozone resistance and chemical stability. It maintains stable waterproof, dustproof, insulating and anti-vibration performance in extreme working environments, with low volatility and strong bonding force. Viscosity, curing hardness and shock absorption performance support full personalized customization.
Product Features & Advantages
1. Superior Shock Absorption: This impact resistant protective encapsulation layer effectively buffers external mechanical shock and vibration to protect delicate components.
2. Drop-Safe Protection: The drop safe module potting compound provides reliable anti-drop and anti-impact protection for portable and mobile electronic devices.
3. All-Round Environmental Stability: Resists wide temperature fluctuations and harsh environments, ensuring long-term stable circuit protection.
4. High Purity & Durability: Low volatile content avoids component contamination, while high structural toughness improves overall module impact resistance.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain stable shock-proof performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes for bubble-free tight encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, with shock absorption performance fully developed after complete curing.
Application Scenarios & Commercial Value
Ideal for portable electronic devices, automotive electronics, industrial control modules and outdoor electronic equipment prone to vibration and impact. Its shock-proof performance reduces component damage caused by drops and shocks, lowers product failure rates and after-sales maintenance costs, improves product durability and market competitiveness.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic manufacturing safety and environmental specifications.
Customization Options
We support personalized customization of viscosity, curing hardness and shock absorption performance to adapt to diverse anti-impact electronic encapsulation processes.
Production Process
Adopting high-toughness shock-proof formula and standardized dust-free production, each batch undergoes strict impact resistance and vibration tests to ensure consistent premium protective quality.
FAQ
Q1: What is the core advantage of shock-proof potting silicone?
A: It is a drop safe module potting compound with excellent impact resistance, protecting electronic
components from mechanical shock and damage.
Q2: Is it suitable for portable and vibration-prone electronic devices?
A: Yes. This impact resistant protective encapsulation layer provides reliable buffering and protection
for mobile and vibration-intensive equipment.
Q3: Does colloidal stratification affect shock-proof performance?
A: No. Stir evenly before use, and it can fully restore stable shock absorption and mechanical shock
circuit protection performance.