Product Overview
This two-component ultra-pure silicone potting material includes addition and condensation curing formulas, specially engineered for high-purity electronic encapsulation. It solves contamination risks of ordinary potting glue for sensitive circuits. It provides excellent encapsulation, sealing and filling protection for precision electronic components, with superior adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates, fully protecting sensitive circuits from impurity interference.
Technical Specifications
This sensitive circuit sealing silicone features ultra-high purity and zero harmful volatile contaminants. It boasts outstanding corrosion resistance, ozone resistance and chemical stability. It maintains stable waterproof, dustproof, insulating and shockproof performance in extreme working environments, with low volatility and strong bonding force. Viscosity, curing hardness and operating time support full personalized customization.
Product Features & Advantages
1. Ultra-High Cleanliness: This high cleanliness protective encapsulation material features strict impurity control, suitable for high-precision sensitive electronic circuits.
2. Contaminant-Free Formula: The contaminant free module potting compound avoids circuit short-circuit and performance degradation caused by impurities.
3. All-Round Environmental Stability: Resists wide temperature fluctuations and harsh environments, ensuring long-term reliable circuit protection.
4. High Purity & Stable Performance: Ultra-low volatile content eliminates component contamination, while uniform curing guarantees consistent protective performance.
Step-by-Step Usage Process
1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to retain ultra-pure protective performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for pure encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, with ultra-pure protection fully formed after curing.
Application Scenarios & Commercial Value
Ideal for high-precision sensitive electronic modules, medical electronic equipment, aerospace electronics and high-end communication devices. Its ultra-pure performance eliminates impurity-related failures, improves product reliability and qualification rate, reduces rework and maintenance costs, and enhances core competitiveness for electronic manufacturers.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global high-precision electronic manufacturing safety and environmental specifications.
Customization Options
We support personalized customization of viscosity, curing hardness and operating time to adapt to diverse ultra-pure precision encapsulation processes.
Production Process
Adopting ultra-pure raw material formula and dust-free standardized production, each batch undergoes strict purity and cleanliness tests to ensure consistent high-quality protection.
FAQ
Q1: What is the core advantage of ultra-pure potting silicone?
A: It is a contaminant free module potting compound with ultra-high cleanliness, protecting sensitive
circuits from impurity interference.
Q2: Is it suitable for high-precision and sensitive electronic equipment?
A: Yes. This high cleanliness protective encapsulation material features zero harmful impurities for
delicate electronic components.
Q3: Does colloidal stratification affect ultra-pure performance?
A: No. Stir evenly before use, and it can fully restore excellent purity and sensitive circuit sealing
performance.