Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high thermal conductivity and efficient heat dissipation 2-component Addition Curing Silicone, featuring excellent thermal conductivity (thermal conductivity ≥0.6 W/(m·K)), efficient heat transfer, low thermal resistance, suitable for heat dissipation and thermal management scenarios. It has fine uniform closed-cell pores with built-in multi-level heat conduction channels, -65℃-250℃ temperature resistance, 1:1 easy operation, passed SGS thermal conductivity certification, compatible with Electronic Potting Compound and high-temperature insulation silicone, serving B2B buyers in electronic, new energy and high-power equipment industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high thermal conductivity heat dissipation core product, specially developed for thermal management, heat dissipation and high-temperature heat transfer scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with composite thermal conductive fillers and heat-dissipating modifiers, which are compounded with fibrous inorganic substances to form fluffy thermal conductive powder, constructing multi-level heat conduction channels that penetrate the foam pores, significantly improving heat dissipation efficiency. It has a thermal conductivity of ≥0.6 W/(m·K), low thermal resistance, efficient heat transfer, fine uniform closed-cell structure, good elasticity and thermal stability, effectively solving the problem of poor heat dissipation of traditional foaming materials due to foam pore thermal resistance. Compatible with most of our electronic and high-temperature products, it is ideal for heat dissipation gaskets, thermal management components and high-power heat transfer scenarios.
Technical Specifications
Type: 2-component addition curing silicone
Thermal Conductivity & Heat Dissipation: Thermal conductivity ≥0.6 W/(m·K), low thermal resistance, efficient heat transfer, built-in multi-level heat conduction channels, heat dissipation efficiency increased by 30% compared with traditional foaming silicone
Foaming Feature: Fine uniform closed-cell pores (20-50μm), thermal conductive filler evenly distributed, forming continuous heat conduction channels, no pore collapse under high temperature
Temperature Range: -65℃ to 250℃ (long-term use), transient temperature resistance up to 350℃
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80-100℃, 30min) vulcanization, secondary curing at 120-150℃ for better heat dissipation performance
Certifications: SGS eco-toxicity, RoHS, SGS thermal conductivity certification, ISO 4637
Key Traits: High thermal conductivity, efficient heat dissipation, thermal conductivity ≥0.6 W/(m·K), multi-level heat conduction channels
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Thermal Conductivity: Thermal conductivity ≥0.6 W/(m·K), built-in multi-level heat conduction channels, solving the problem of poor heat dissipation of traditional foaming materials due to foam pore thermal resistance.
2. Efficient Heat Dissipation: Low thermal resistance, fast heat transfer, can quickly conduct and dissipate heat generated by electronic components and high-power equipment, ensuring stable operation of equipment.
3. Thermal Conductivity & Elasticity Balance: While maintaining high thermal conductivity and efficient heat dissipation, it retains good elasticity and structural stability, no brittle fracture under high temperature, balancing heat dissipation performance and usability.
4. Compatibility with Thermal Management Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-temperature insulation silicone, forming a complete thermal management solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat dissipation components, no professional thermal management operation skills required, suitable for large-scale production.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting thermal conductivity and heat dissipation performance).
2. Mix and stir thoroughly for 2-3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure uniform distribution of thermal conductive fillers and heat conduction channels).
3. Pour the mixture into heat dissipation component mold (paired with electronic potting compound), foam and cure at 80-100℃ for 30 minutes (primary curing), then perform secondary curing at 120-150℃.
4. After full curing, the product has excellent thermal conductivity and heat dissipation performance, ready for use in thermal management and heat dissipation scenarios such as new energy battery modules and high-power electronic equipment.
Application Scenarios
Focus on thermal management scenarios: New energy battery cell module heat dissipation gaskets (paired with electronic potting compound), high-power LED heat dissipation components (paired with high-temperature insulation silicone), 5G communication equipment heat dissipation buffers (paired with Industrial mold silicone rubber), aerospace electronic equipment heat transfer parts (paired with high-precision Mold Silicone ), and energy storage system thermal management components (paired with Liquid Tank Silicone). It helps thermal management buyers improve equipment heat dissipation efficiency and extend service life.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS thermal conductivity certification, ISO 4637, excellent high thermal conductivity and heat dissipation performance, meeting the thermal management procurement requirements of B2B buyers in electronic, new energy and aerospace industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥1.0 W/(m·K) for high-demand scenarios), heat dissipation efficiency, foaming ratio and hardness, adapting to different thermal management and heat dissipation requirements, helping buyers optimize equipment heat transfer effect.
Production Process
High thermal conductivity-oriented production process: High-purity thermal conductive Silicone raw materials → formula optimization (compounding thermal conductive powder with fibrous inorganic substances to form fluffy thermal conductive powder) → precision mixing → thermal conductivity test → heat dissipation efficiency test → primary curing → secondary curing → thermal stability inspection → packaging. Strict thermal conductivity testing ensures product efficient heat dissipation performance.
FAQ
Q1: What is the thermal conductivity? A: ≥0.6 W/(m·K), built-in multi-level heat conduction channels, efficient heat transfer and heat dissipation.
Q2: Is it suitable for new energy batteries? A: Yes, ideal for new energy battery cell module heat dissipation gaskets, which can quickly dissipate the heat generated by battery charging and discharging.
Q3: Will the heat dissipation performance decrease at high temperature? A: No, thermal stability is excellent, heat dissipation performance remains stable even at 250℃ long-term use.
Q4: Does it need special processing for heat dissipation? A: No, 1:1 simple mixing and curing, no special equipment required, easy to process into various heat dissipation components.
Shenzhen Hong Ye Jie Technology Co., Ltd
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