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Home> Products> Human Body Silicone> High Thermal Conductivity Heat Dissipation Bionic Skin Silicone
High Thermal Conductivity Heat Dissipation Bionic Skin Silicone
High Thermal Conductivity Heat Dissipation Bionic Skin Silicone
High Thermal Conductivity Heat Dissipation Bionic Skin Silicone
High Thermal Conductivity Heat Dissipation Bionic Skin Silicone
High Thermal Conductivity Heat Dissipation Bionic Skin Silicone
High Thermal Conductivity Heat Dissipation Bionic Skin Silicone
High Thermal Conductivity Heat Dissipation Bionic Skin Silicone

High Thermal Conductivity Heat Dissipation Bionic Skin Silicone

$10-16 /

Payment Type:L/C,Paypal
Incoterm:FOB,DDP
Min. Order:1
Transportation:Ocean,Land,Air,Express
Product Attributes

Model No.: HY-E630

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Product Description
High thermal conductivity heat dissipation bionic skin silicone is thermally modified platinum-cured RTV-2 liquid bionic silicone developed by Shenzhen Hong Ye Jie Technology for high-density electronic integrated dynamic humanoid robot industry. New generation humanoid robots integrate a large number of flexible pressure sensors, micro signal acquisition chips and small drive components under bionic skin. Electronic components continuously produce heat when robots run non-stop for exhibition or research test. Conventional bionic silicone is thermal insulation material with high thermal resistance. Heat generated internally is trapped between skin and electronic parts and hard to dissipate outward, building up local high temperature hot spots.
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High temperature brings multiple adverse effects. First, sensing films and chips suffer zero point drift under heat, leading to distorted sensing data and wrong robot tactile recognition. Second, electronic components age faster under long term high temperature and service life shortens, raising equipment maintenance rate. Third, internal high temperature accelerates silicone polymer aging, skin turns yellow and brittle easily with declined mechanical performance. Fourth, surface temperature rises and creates hot touch feeling during human robot interaction, damaging visitor experience. Many humanoid robot prototypes perform well in static test, but suffer sensing error or overheat protection shutdown after long continuous running due to internal heat accumulation, failing to meet the requirement of long-time uninterrupted commercial exhibition.

This high thermal conductivity heat dissipation bionic skin silicone adopts compound modification technology with special thermal conductive powder. It improves thermal conductivity while maintaining silicone flexibility and realistic skin texture. Core selling points: high thermal conductivity, quickly transfer accumulated heat from chips and sensing layers, no heat accumulation on skin after long continuous operation, low thermal resistance, uniform heat distribution without local hot spots, balances flexible bionic touch and heat dissipation performance. When built-in chips and sensors keep generating heat, heat can be transmitted outward evenly through silicone skin, lowering component surface temperature and eliminating local hot spots. The material remains flexible and elastic to replicate delicate human skin texture, and will not become hard and lose bionic touch because of thermal conductive filler.

It follows standard 1:1 weight mixing ratio and cures at room temperature, heating can accelerate curing. Both pouring and brushing coating processes are supported for integrated molding of face, palm and arm skin of humanoid robots with massive built-in sensing chips. Hardness ranges from 5A to 20A. 5A‑10A ultra-soft grade fits palm and facial skin with soft skin friendly touch and stable heat dissipation performance. 11A‑20A grade is suitable for large-area skin of arms and torso, balancing thermal conductivity, tear resistance and tensile durability.

Core advantages: high thermal conductivity, quickly transfer accumulated heat from chips and sensing layers, no heat accumulation on skin after long continuous operation, low thermal resistance, uniform heat distribution without local hot spots, balances flexible bionic touch and heat dissipation performance. Most bionic silicone products only optimize appearance and tensile touch without thermal conductive formula modification for internal electronic heat dissipation. It feels soft in static touch but has no heat transfer capacity, resulting in severe heat accumulation during long time working. This high thermal conductivity heat dissipation bionic silicone specially solves internal heat accumulation issue for humanoid robots with dense integrated sensors. Heat can continuously dissipate outward during hours of continuous robot operation and will not gather inside skin to form high temperature zones. After long thermal cycle aging test, thermal conductivity will not decrease obviously after repeated temperature rise and fall, surface stays intact without cracking or powdering and bionic texture remains complete. Ultra-low curing shrinkage precisely replicates fine human skin pores and lines. Even filled with thermal conductive filler, it still feels soft without rough fake skin texture.

The formula has passed large batches of thermal cycle aging, thermal conductivity stability, tensile and tear durability test. Thermal performance remains stable during long continuous power-on operation and will not drop with service time. Excellent tear strength prevents cracking under repeated joint bending. Platinum eco-friendly system is non-toxic and odorless, safe for close human robot interaction. Fluidity of silicone is optimized to balance dispersion of thermal conductive filler and pouring flowability. It has great defoaming performance and produces few bubbles on complex curved molds with uniform color. Batch indicators including thermal conductivity and thermal resistance are stable for small prototype sampling and mass skin production for high-density electronic integrated humanoid robot projects.

Shenzhen Hong Ye Jie Technology maintains a full differentiated bionic silicone portfolio covering self-healing, hydrolysis-resistant, high-tear-strength, low-shrinkage precision molding, high-resilience anti-deformation, matte anti-fingerprint, zero-bleed clean-grade, low-odor low-VOC, antibacterial hygienic, weathering anti-aging, anti-static low dust accumulation, sensor-compatible flexible substrate, high elongation large stretch, wide temperature range stable, sebum resistant anti-grease, low friction silent and this new high thermal conductivity heat dissipation series. Customization for hardness, skin tone and thermal conductivity indicators is available. Thermal conductivity and thermal cycle aging test reports and sample evaluation can be provided to help high-density sensing humanoid robot projects solve internal heat accumulation problem, stabilize sensing signals, slow down aging of electronic components, reduce shutdown failure probability and improve reliability and human interaction experience of long continuous exhibition.

Main Features Modified formula with thermal conductive filler, low thermal resistance, efficiently transfer accumulated heat of internal sensing chips No heat accumulation on skin during long continuous operation, evenly spread heat and eliminate local high temperature hot spots Combine high thermal conductivity and flexible bionic touch, replicate delicate human skin texture without rough feeling Stable thermal performance under thermal cycles, thermal index has no obvious attenuation after repeated high-low temperature cycles Platinum eco-friendly formula, non-toxic and odorless, safe and non-irritating for close human robot interaction Great molding compatibility, supports pouring and brushing molding for all kinds of skin integrated with sensing modules Stable batch thermal conductivity performance, thermal conductivity and thermal resistance inspection for each batch, available for prototype and mass projects

Operating Instructions Stir Part A and Part B separately for more than 3 minutes before use. Mix strictly at 1:1 weight ratio and fully stir for 2‑3 minutes while scraping bottom and wall. Carry out sufficient vacuum defoaming after mixing to reduce bubble defects. Room temperature pot life is 40‑50 minutes; full curing takes 6‑10 hours at room temperature. Heat at 50‑70℃ to accelerate curing without damaging core high thermal conductivity heat dissipation performance. For robots with dense sensing modules, make samples in advance and complete long time continuous running heat dissipation reliability verification.

Notes Platinum cured silicone must avoid contamination of sulfur, tin, lead and phosphorus substances, which may cause curing failure and degrade thermal conductivity performance. Keep mixing containers and molds clean and dry. This material contains thermal conductive powder. Heavy dust accumulation on surface may slightly reduce surface heat dissipation efficiency, regular simple cleaning is recommended. Keep finished products away from strong solvent contact to extend skin service life. Store in cool and ventilated warehouse away from high temperature heat source.

Packing & Storage Part A and Part B are separately sealed in drums: 5KG, 20KG, 200KG. Store in cool dry and ventilated warehouse away from high temperature heat source. Sealed shelf life is 12 months. Non hazardous goods, regular logistics available.

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