Product Overview
Our Electronic Potting Silicone is a high-performance Silicone Encapsulant , composed of transparent Component A and blue Component B (color customizable). It has superior insulation performance, excellent high-temperature resistance (adapting to high-temperature ovens, induction cookers and high-temperature air filters), and strong moisture-proof, shockproof and corrosion-resistant properties. With strong compatibility with metals and plastics, it is a reliable choice for high-end electronic circuit boards, power modules and high-temperature equipment that require strict insulation and high-temperature resistance.
Technical Specifications
Mixing ratio (A:B): 1:1 (weight);
Degassing: 0.08MPa for 3 minutes;
Curing time: 3-8h (25℃), 20min (80-100℃);
Storage life: 1 year (sealed);
Packaging: 1, 5, 20, 25, 200KG/barrel;
Transportation: Non-hazardous;
Compatibility: Aluminum, galvanized steel, PC, PP, ABS, PVC;
Insulation performance: Excellent, meeting high-end electronic industry standards;
High-temperature resistance: Stable performance in high-temperature environments (adapt to high-temperature equipment).
Product Features & Advantages
Superior insulation performance, effectively protecting electronic components from short circuits and leakage, ensuring safe operation; excellent high-temperature resistance, no deformation, cracking or oil seepage in high-temperature environments, extending product service life; Platinum cured Mold Silicone technology, stable performance and long service life, outperforming Condensation curing silicone mold rubber; low viscosity, easy to pour into complex electronic components; dual curing methods, flexible and convenient; high toughness, able to absorb thermal expansion stress without cracking; excellent sealing, moisture-proof and corrosion-resistant; wide compatibility, same as our Industrial mold silicone rubber and Pad printing silicone.
How to Use
1. Stir Component A and B separately in their containers to ensure uniform insulation and high-temperature resistance performance.
2. Mix Component A and B at a 1:1 weight ratio, stirring thoroughly for 2-3 minutes until uniform, avoiding air bubbles that affect insulation.
3. Degas the mixed glue at 0.08MPa for 3 minutes, then pour gently into high-end electronic components or high-temperature equipment slots.
4. Cure at 25℃ for 3-8 hours; heating curing at 80-100℃ for 20 minutes ensures better high-temperature resistance and insulation performance.
Application Scenarios
Widely used for high-end electronic circuit boards, power modules, optical electronics, LCD manufacturing, high-temperature ovens, induction cookers and high-temperature air filters. As a high-performance Thermally Conductive Potting Compound , it provides reliable insulation, high-temperature protection and sealing, helping buyers improve product durability, safety and competitiveness in high-end markets.
Certifications and Compliance
Certified by ISO9001, CE, RoHS and UL, complying with high-end electronic and high-temperature equipment industry standards, ensuring product safety, reliability and compliance with global high-end market requirements.
Customization Options
Formula customization available to enhance insulation performance or high-temperature resistance according to customer needs; Component B color and packaging specifications can be adjusted, same as our customization services for Industrial mold silicone rubber and Pad printing silicone.
Production Process
Our production process includes strict insulation and high-temperature performance testing, from the selection of high-purity Silicone raw materials to precise mixing and curing. Professional technicians optimize the formula to ensure excellent insulation and high-temperature resistance, same as our production standards for high-performance Pad printing silicone.
FAQ
Q: What is the high-temperature resistance of this product?
A: It can adapt to high-temperature equipment such as ovens and induction cookers, maintaining stable performance without deformation.
Q: Is it suitable for high-end electronic components?
A: Yes, its superior insulation performance ensures safe operation of high-end electronics.
Q: Can the formula be customized for better insulation?
A: Yes, we can optimize the formula to meet specific insulation requirements.
Q: Is it compatible with stainless steel and PC materials?
A: Yes, it has strong compatibility with various metals and plastics.