Industrial Grade Silicone Encapsulant for PCB

Industrial Grade Silicone Encapsulant for PCB

Name: Liquid tank adhesive 9400（2）
Uploaded: 2026-01-28T06:31:21+08:00
Description: HONG YE SILICONE Electronic Encapsulation Adhesive is industrial grade Potting Compound formulated with pure

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Model No.: HY-9400/HY-9405

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
Picture Example	:

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Liquid tank adhesive 9400（2）

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Product Description

HONG YE SILICONE Electronic Encapsulation Adhesive is industrial grade Potting Compound formulated with pure Silicone raw materials. As reliable Liquid Tank Sealant and Silicone Encapsulant, it is an advanced Addition Curing Silicone with stable RTV 2 Silicone Rubber performance. 1:1 simple mixing, room & heat dual curing, high flexibility and multi-material adhesion make it ideal for circuit board potting, filter sealing and high-temperature equipment bonding. Eco-friendly and durable, it is a cost-effective solution for global electronic manufacturers.

Product Overview

This electronic potting silicone is a two-component elastic jelly type silicone, widely recognized as Liquid Tank Adhesive and potting compound. Transparent Part A and customizable Part B support personalized color matching. It provides perfect sealing, shockproof and insulation protection after curing, with quality consistency same as High transparency mold silicone, suitable for high-end electronics and air filter systems.

Technical Specifications

Weight ratio 1:1 for A and B; 3 minutes vacuum degassing. Natural curing 3–8h at ambient temperature, fast curing 20min at 80–100℃. Multiple packaging sizes optional, 1 year sealed storage, non-dangerous logistics allowed.

Product Features

Excellent aging resistance and waterproof performance, stable in humid and corrosive environment. Good flexibility absorbs structural deformation without breakage. Strong adhesion to aluminum, stainless steel, galvanized sheet and plastics like PC, PP, ABS. Low viscosity for easy manual and machine pouring.

How to Use

Stir each component well before compounding.

Mix Part A and Part B accurately in 1:1 proportion.

Stir uniformly and remove bubbles before pouring construction.

Adjust curing method according to ambient temperature.

Application Scenarios

Covers electronic circuit board encapsulation, optical electronic assembly, LCD production and various high-temperature equipment sealing. It improves product insulation safety and reduces after-sales maintenance cost greatly.

Certifications and Compliance

Meets global environmental regulations and industrial certification requirements, safe for worldwide export.