Liquid Silicone Electronic Potting Compound for PCB

Liquid Silicone Electronic Potting Compound for PCB

Name: Liquid tank adhesive 9400（2）
Uploaded: 2026-01-28T06:31:21+08:00
Description: Our Silicone Potting Compound is premium two-part liquid silicone designed for industrial potting and sealing. Made of

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Model No.: HY-9400/HY-9405

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
Picture Example	:

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Liquid tank adhesive 9400（2）

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Product Description

Our Silicone Potting Compound is premium two-part liquid silicone designed for industrial potting and sealing. Made of selected Silicone raw materials, it acts as professional Electronic Potting Compound, Liquid Tank Silicone and Filter Potting Silicone. Adopting Addition Curing Silicone technology, it features low viscosity, no oil leakage, high toughness and weather resistance. Compatible with various metals and plastics, it supports room temperature and heating curing, perfect for electronics, LCD, filter and high-temperature device application for global industrial buyers.

Product Overview

This two-component RTV silicone rubber is specially formulated for liquid tank filter potting and PCB electronic encapsulation. It features transparent A liquid and blue standard B liquid, with customizable color upon request. Safe, environmental and high elastic, it delivers stable sealing effect, comparable to the performance of Rapid prototyping silicone, widely used in power modules and high-efficiency air outlets.

Technical Specifications

1:1 weight mixing ratio; degassing 3min at 0.08MPa. Room temp curing 3–8 hours, high temp curing 20min at 80–100℃. Standard drum packaging 1KG–200KG, shelf life 1 year sealed storage.

Product Features

Superior high and low temperature resistance, no deformation under drastic temperature change. Good elastic recovery and stress dispersion ability to prevent cracking. Curing without any toxic by-products, safe for electronic internal sealing. Good fluidity ensures no bubble residue during pouring.

How to Use

Stir A and B components separately to restore uniformity.

Mix strictly by 1:1 weight proportion.

After full mixing, vacuum defoam then pour into required position.

Heat accelerate curing in winter for higher working efficiency.

Application Scenarios

Suitable for precision electronic components, optical electronics, liquid tank filter system, high-temperature oven and induction cooker sealing. It enhances product stability and prolongs service life obviously.

Certifications and Compliance

Conforms to international industrial and environmental standards, suitable for Europe, America and Southeast Asia market export.