HONG YE SILICONE's Electronic Potting Compound, also known as Silicone Encapsulant, is a highquality potting material with waterproof, moistureproof, thermal conductive, flameretardant and insulating properties. It cures into a solid form after adding a curing agent, effectively protecting electronic components. Compatible with PC, PMMA, PCB and CPU, it offers excellent adhesion and thermal stability. Available in addition curing and condensation curing types, it operates from 60℃ to 220℃, serving diverse industries worldwide with over 20 years of manufacturing expertise.
Product Overview
Electronic Potting Compound (Silicone Potting Compound) is a core product of HONG YE JIE, a global leading silicone manufacturer with ISO9001, UL and CE certifications. This versatile encapsulant, also called Electronic Encapsulation Adhesive, is designed to seal, fill and protect electronic components. It integrates multiple functions to shield components from moisture, dust, corrosion and vibration, ensuring stable operation even in harsh environments. As a key part of our product range, it complements other core offerings like RTV2 Silicone Rubber and Thermal Conductive Silicone, catering to global procurement needs.
Product Features & Advantages
Comprehensive protection: Provides waterproof, moistureproof, dustproof, anticorrosion, insulation, thermal conductivity and shockproof effects, safeguarding components comprehensively.
Wide temperature resistance: Functions stably from 60℃ to 220℃, absorbing thermal stress to protect chips and gold wires.
Strong adhesion: Bonds excellently with metals (aluminum, copper, stainless steel) and materials like PC, PMMA, PCB.
Highquality formulation: Low volatile content, high strength and antiozone, chemical erosion resistance.
Two types available: Addition curing and condensation curing silicone potting compound to meet different application requirements.
Technical Specifications
Curing type: Addition curing / Condensation curing
Operating temperature range: 60℃ to 220℃
Key properties: Waterproof, moistureproof, thermal conductive, flameretardant, insulating
Adhesion: Compatible with PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Volatile content: Low
Full curing time: 24 hours (room temperature or heated curing)
How to Use
1. Prepararation: Thoroughly stir Component A to mix settled fillers evenly; shake Component B well.
2. Mixing: Blend A and B components according to the specified weight ratio.
3. Deaeration: Place mixed adhesive in a vacuum container, degas at 0.01MPa for 3 minutes (optional, based on needs).
4. Potting: Pour the treated adhesive onto electronic components.
5. Curing: Allow to cure at room temperature or with heating; proceed to next process after initial curing, with full curing in 24 hours.
Application Scenarios
Ideal for encapsulation, sealing, filling and pressure protection of electronic components. Widely used in LED displays, CPUrelated equipment, electronic control modules, power supplies and communication devices. Suitable for industries like electronics manufacturing, automotive electronics, industrial control and telecommunications, enhancing product reliability and lifespan.
Certifications and Compliance
Our Electronic Potting Compound meets international standards, with the company holding ISO9001, UL and CE certifications. It complies with global quality and safety requirements, ensuring reliability for international applications.
Customization Options
We offer customized solutions for curing hardness, viscosity, operating time and other parameters. Contact our team to tailor the product to your specific application needs, leveraging our OEM service capabilities.
Production Process
The product undergoes strict quality control, including raw material inspection, precise formulation mixing, automated production on our 20 production lines, preproduction sampling and final inspection before shipment. Our QC team ensures consistent quality, backed by over 20 years of silicone manufacturing experience.
FAQ
Q1: What is the difference between addition curing and condensation curing types?
A1: Addition curing offers faster curing speed and lower shrinkage, while condensation curing is costeffective for general applications. Both provide reliable protection.
Q2: Can it be used for hightemperature electronic devices?
A2: Yes, it operates stably from 60℃ to 220℃, suitable for hightemperature environments.
Q3: How should unused adhesive be stored?
A3: Seal and store unused components. Mixed adhesive must be used immediately to avoid waste.
Q4: Does it affect electronic components?
A4: No, it is noncorrosive and compatible with common electronic materials, ensuring component safety.
Q5: Is customization available for special requirements?
A5: Yes, we offer customization for hardness, viscosity, operating time and other parameters to meet specific needs.
Shenzhen Hong Ye Jie Technology Co., Ltd
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