HONG YE SILICONE’s Electronic Potting Silicone for Robotics is a high-performance Silicone Encapsulant tailored for robotic electronic components. Also called Silicone Potting Compound or Electronic Encapsulation Adhesive, it cures into a solid protective layer after adding hardener, featuring waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. With temperature resistance of -60℃ to 220℃, strong adhesion and low volatility, it supports customization of hardness, viscosity and operating time. Compliant with ISO9001, CE and UL certifications, it pairs with our robot silicone to ensure stable operation of robotics in harsh environments, meeting global B2B procurement standards.
Product Overview
As a core product of HONG YE SILICONE, our Electronic Potting Silicone for Robotics is specially engineered to protect sensitive electronic components in industrial and service robots. Different from epoxy potting resin, this silicone-based encapsulant has superior flexibility and stress absorption capacity. Before curing, it is a flowable liquid; after mixing with hardener, it cures at room or elevated temperature, forming a tight protective layer that bonds, seals, fills and protects robotic PC, PCB, CPU and other components, effectively extending the service life of robotic electronic systems.
Product Features
1. Comprehensive protection: Offers excellent corrosion, water, moisture and dust resistance, along with insulation, thermal conductivity, shock absorption and confidentiality, fully isolating robotic electronics from harsh working conditions.
2. Extreme temperature adaptability: Operates stably from -60℃ to 220℃, absorbs thermal cycle stress, and protects robot chips and welding gold wires from damage, adapting to complex robotic working environments.
3. Strong adhesion & low volatility: High bonding strength to aluminum, copper, stainless steel and robotic substrates (PC, PMMA, PCB), low volatile content and high cured strength, ensuring long-term stability.
4. Dual curing options: Available in Addition Curing Silicone and condensation curing silicone, matching different robotic production processes and efficiency requirements, easy to operate. 5. Chemical & ozone resistance: Resists ozone and chemical erosion, maintaining performance without aging, suitable for long-term use of industrial robots.
Technical Specifications
This robotic electronic potting silicone is made of high-quality Silicone raw materials, with excellent thermal conductivity and flame retardancy to meet robotic heat dissipation and safety needs. Cured hardness, viscosity and operating time are customizable; full curing takes 24 hours at room temperature, with environmental temperature and humidity affecting curing speed. It has no corrosion to robotic electronic components, good fluidity before curing, and meets international electronic material standards, compatible with our Thermally Conductive Potting Compound. Application Scenarios
Widely used in encapsulation and protection of electronic components in various robots, including industrial robot control systems, collaborative robot PCB boards, service robot CPU modules, robot sensors, drive units and power components. It is suitable for automotive robots, industrial handling robots, medical auxiliary robots and smart robots, effectively solving problems such as water seepage, short circuit, heat accumulation and vibration damage of robotic electronics.
Core Value for Buyers
1. Enhance robot reliability: Comprehensive protection reduces electronic component failure rate, improving robot operation stability and brand competitiveness.
2. Reduce costs: Simple operation process, no complex equipment required; customizable parameters match production lines, improving efficiency and reducing waste.
3. Strong compatibility: Adapts to various robotic electronic materials and production processes, no need to replace potting materials for different robot models.
4. Compliance assurance: Passes international certifications, meeting import requirements of global markets, avoiding trade barriers.
How to Use
1. Pre-mixing: Fully stir Component A to mix settled fillers evenly, and shake Component B (hardener) thoroughly.
2. Mixing: Stir Component A and B in the specified weight ratio until fully fused.
3. Defoaming: Put mixed glue into a vacuum container, defoam at 0.01MPa for 3 minutes before potting.
4. Potting & curing: Pour defoamed glue into robotic electronic components, cure at room or elevated temperature; proceed to next process after basic curing, full curing in 24 hours.
Certifications and Compliance
Produced under HONG YE SILICONE’s ISO9001 quality management system, this product has passed CE and UL certifications, complying with international electronic component safety and environmental standards, meeting the procurement requirements of global robot manufacturers in Europe, America, Asia and other regions.
Customization Options
We offer personalized customization for robotic production needs: adjust cured hardness, viscosity, operating time and curing speed; customize addition/condensation curing types; develop special formulas for high-temperature or high-thermal-conductivity robotic scenarios. We also provide one-stop solutions with our robot silicone and silicone encapsulant.
FAQ
Q1: Will it affect the heat dissipation of robot electronic components? A1: No, it has excellent thermal conductivity, conducting heat timely while protecting components.
Q2: Can it be used for precise robot sensors? A2: Yes, it has good fluidity before curing, filling fine gaps without damaging sensors after curing.
Q3: How to store unopened potting silicone? A3: Seal and store in a cool, dry place; stir evenly if layered, no impact on performance.
Q4: Can mixed glue be stored? A4: No, use mixed glue at one time to avoid curing and waste.
Q5: Is it safe to use? A5: Yes, it is non-hazardous; avoid contact with mouth and eyes, rinse with water if accidentally contacted.
Shenzhen Hong Ye Jie Technology Co., Ltd
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