HONG YE SILICONE’s Electronic Potting Compound for Audio Equipment (Model HY-9055) is a high-performance two-component Silicone Encapsulant tailored for audio devices. It features low viscosity, fast room-temperature deep curing, excellent adhesion and thermal conductivity, fully complying with EU RoHS directives and UL94-V1 flame retardant standards. With customizable hardness, viscosity and operating time, it protects audio electronic components without affecting sound quality, paired with our Silicone raw materials and silicone encapsulant to meet global B2B procurement and audio industry quality requirements.
Product Overview
As a core audio-grade product of HONG YE SILICONE, our Electronic Potting Compound (also called Silicone Potting Compound or Electronic Encapsulation Adhesive) is engineered to protect sensitive audio electronic components. Different from epoxy potting resin, this low-viscosity two-component silicone cures quickly at room temperature, forming a soft, dense protective layer. It bonds perfectly to PC, PP, ABS, PVC and metal surfaces, widely used for potting, insulation, waterproofing and sealing of audio equipment modules, ensuring stable operation and uncompromised sound quality in various audio devices. Product Features
1. Audio-friendly protection: Soft cured texture, no interference with audio signal transmission, effectively protecting audio circuits while maintaining original sound quality.
2. Excellent thermal conductivity: ≥0.4W(m·K) thermal conductivity, quickly dissipates heat from audio amplifiers and chips, avoiding overheating-induced performance degradation.
3. Easy operation & fast curing: 1:1 weight mixing ratio, 30-120 mins operable time, 3-5 hrs initial curing, 12-24 hrs full curing; easy defoaming, suitable for audio equipment automated production.
4. Superior electrical & safety performance: High insulation (dielectric strength ≥25KV/mm), UL94-V1 flame retardant, compliant with EU RoHS, safe and environmentally friendly, preventing audio circuit short circuits.
5. Customizable & stable: Customizable hardness (55±5 Shore A adjustable), viscosity and operating time; 12-month shelf life, stir evenly if layered, no impact on performance.
Technical Specifications
Model HY-9055: Two-component liquid, A组份 viscosity 3000±500cps, 1:1 weight mixing ratio. Cured hardness 55±5 Shore A, thermal conductivity ≥0.4W(m·K), dielectric strength ≥25KV/mm, volume resistivity ≥1.0×10¹⁶Ω·cm, UL94-V1 flame retardant. Non-hazardous, 12-month shelf life, transportable as general chemicals; other models and customizable parameters are available to match diverse audio production needs.
Application Scenarios
Widely applied in potting and protection of various audio equipment electronic components, including audio amplifiers, speakers, headphones, microphones, sound mixers and audio control modules. It is suitable for consumer audio, professional audio and car audio, effectively insulating, waterproofing and fixing audio electronic parts, preventing performance failure caused by moisture, dust or heat accumulation.
Core Value for Buyers
1. Protect sound quality: Audio-friendly formula avoids signal interference, ensuring the original sound quality of audio products and enhancing product competitiveness.
2. Improve production efficiency: Fast curing, simple operation and 1:1 mixing ratio adapt to automated assembly lines, reducing production time and waste.
3. Extend product life: Effective heat dissipation and protection reduce audio electronic failure rate, lowering after-sales maintenance costs.
4. Compliance assurance: Meets EU RoHS and UL standards, avoiding trade barriers, suitable for global audio equipment markets.
How to Use
1. Pre-mixing: Fully stir Component A to mix settled fillers evenly, and shake Component B thoroughly before use.
2. Mixing: Mix Component A and B in 1:1 weight ratio, stir evenly until fully fused.
3. Defoaming: Put mixed glue into a vacuum container, defoam at 0.08MPa for 3 minutes, then proceed to potting.
4. Potting & curing: Pour defoamed glue into audio electronic components, cure at room temperature; enter next process after initial curing, full curing in 12-24 hours (temperature/humidity affects curing speed).
Certifications and Compliance
Produced under HONG YE SILICONE’s ISO9001 quality management system, this product fully complies with EU RoHS directives and has UL94-V1 flame retardant certification, meeting international audio electronic safety and environmental standards, ensuring it passes import inspections of global markets.
Customization Options & Packaging
Customization: Adjustable cured hardness, viscosity, operating time and curing speed; custom formulas for high-thermal-conductivity or ultra-soft audio scenarios. Packaging: 5kg, 20kg, 25kg and 200kg, suitable for bulk B2B procurement and different production batch needs.
FAQ
Q1: Will it affect the sound quality of audio equipment? A1: No, its soft cured texture does not interfere with audio signal transmission, ensuring original sound quality.
Q2: Can it be used for small audio components like headphone chips? A2: Yes, low viscosity ensures it fills fine gaps of small components without damaging them.
Q3: How to store unopened potting compound? A3: Seal and store in a cool, dry place; 12-month shelf life, stir evenly if layered.
Q4: Is mixed glue reusable? A4: No, mixed A/B components should be used up at one time to avoid curing and waste.
Q5: Are other models available besides HY-9055? A5: Yes, we provide customized parameters and models to match different audio equipment production needs.
Shenzhen Hong Ye Jie Technology Co., Ltd
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