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Home> Products> Electronic Potting Compound> Electronic Potting Compound for 5G Base Stations
Electronic Potting Compound for 5G Base Stations
Electronic Potting Compound for 5G Base Stations
Electronic Potting Compound for 5G Base Stations
Electronic Potting Compound for 5G Base Stations
Electronic Potting Compound for 5G Base Stations
Electronic Potting Compound for 5G Base Stations

Electronic Potting Compound for 5G Base Stations

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9055

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE Electronic Potting Compound (Model HY-9055) is a two-component, 1:1 mix ratio Silicone Potting Compound designed for 5G base stations. It is a low-viscosity liquid silicone with fast room-temperature deep curing, excellent adhesion to PC, PP, ABS, PVC and metals. Featuring high insulation, thermal conductivity, flame retardancy (UL94-V1) and ROHS compliance, it ensures stable operation of 5G base station electronics in outdoor, high-frequency, harsh environments for global telecom clients.
 
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Product Overview

Our Electronic Potting Compound, also called Electronic Encapsulation Adhesive or Silicone Encapsulant, is a high-performance protective material engineered for 5G base station components. As an experienced RTV 2 Silicone Rubber manufacturer with over 15 years of export experience, we provide a reliable solution for 5G base station modules, offering comprehensive sealing, insulation and anti-interference protection. This liquid silicone cures into a durable elastomer, safeguarding sensitive 5G electronics from environmental hazards and ensuring stable signal transmission.

Technical Specifications

Model HY-9055 is a two-component liquid silicone with a 1:1 weight mix ratio. Key parameters: dynamic viscosity 3000±500 mPa·s; operating time 30-120 minutes; basic curing time 3-5 hours; full curing time 12-24 hours; hardness 55±5 Shore A; thermal conductivity ≥0.4 W(m·k); dielectric strength ≥25 KV/mm; dielectric constant 3.0~3.3 (1.2MHz); volume resistivity ≥1.0×10¹⁶ Ω·cm; flame retardancy UL94-V1. Hardness, viscosity and operating time can be customized per customer needs.

Product Features & Advantages

- Low viscosity and fast room-temperature deep curing, improving production efficiency for 5G base station mass production. - Excellent adhesion to various materials (PC, PP, ABS, PVC and metals), ensuring firm sealing of 5G modules. - High insulation and anti-electromagnetic interference (EMI), critical for stable 5G signal transmission and component safety. - Flame retardant (UL94-V1) and ROHS compliant, meeting international telecom industry safety and environmental standards. - Good thermal conductivity, timely dissipating heat from high-power 5G components, avoiding overheating damage. - Superior to ordinary Electronic potting compound, with strong weather resistance, adapting to outdoor wind, rain and temperature changes. - Low volatility, stable performance, ensuring long-term reliability of 5G base stations in harsh environments.

How to Use

1. Before mixing, fully stir Part A to evenly distribute settled fillers, and shake Part B thoroughly to ensure uniformity. 2. Mix Part A and Part B at a 1:1 weight ratio for stable curing and reliable protection. 3. Degas if needed: put the mixed silicone into a vacuum container, degas at 0.08MPa for 3 minutes, then pour into 5G base station components. 4. Cure at room temperature; basic curing completes before the next process, and full curing takes 12-24 hours (temperature and humidity affect curing effect).

Application Scenarios

This Thermally Conductive Potting Compound is mainly used in 5G base stations, including 5G signal modules, PCB boards, power supply units, communication chips and connection terminals. It effectively protects 5G electronics from moisture, dust, EMI and temperature changes, reduces failure rates, extends base station service life, ensures stable signal transmission, lowers maintenance costs, and supports the efficient operation of 5G telecom networks for global clients.

Customization Options

We provide flexible customization services, including adjusting curing speed, viscosity, hardness and thermal conductivity to match 5G base station component requirements. Special formulas with enhanced EMI resistance and high-temperature resistance are available, supporting OEM services to meet personalized needs of global telecom purchasers.

Certifications & Compliance

Our Electronic Potting Compound complies with EU ROHS directive, UL94-V1 flame retardant standard, ISO9001, CE and UL certifications. With 91%-100% export rate, our products meet strict quality and safety requirements of global telecom industries, widely used in 5G base station projects worldwide.

FAQ

Q: Is this potting compound suitable for outdoor 5G base stations? A: Yes, it has excellent weather resistance, waterproof and dust-proof performance, adapting to outdoor harsh environments and ensuring long-term stable operation. Q: Can it be customized for high-power 5G modules? A: Yes, we can adjust thermal conductivity and viscosity to meet the heat dissipation and pouring needs of high-power 5G components. Q: What is the shelf life and transportation method? A: Shelf life is 12 months; it is non-hazardous and can be transported as general chemicals. Q: How to handle layered silicone after long-term storage? A: Stir evenly before use; layering does not affect performance, and it can still provide reliable protection for 5G components.
 
 
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