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Home> Products> Electronic Potting Compound> Electronic Potting for Automation Sensor Systems
Electronic Potting for Automation Sensor Systems
Electronic Potting for Automation Sensor Systems
Electronic Potting for Automation Sensor Systems
Electronic Potting for Automation Sensor Systems
Electronic Potting for Automation Sensor Systems
Electronic Potting for Automation Sensor Systems

Electronic Potting for Automation Sensor Systems

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9040

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE Electronic Potting is a high-performance Silicone Potting Compound designed for automation sensor systems, a core Silicone raw material with excellent anti-interference, shock resistance and precise signal protection. As a premium Electronic Encapsulation Adhesive, this dual-component Addition Curing Silicone features adjustable parameters, strong adhesion and stable curing. Fully complying with ISO, CE and RoHS standards, it reliably protects automation sensor components, ensuring accurate signal transmission and stable operation in industrial automation scenarios, meeting global automation equipment manufacturer demands.
 
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Product Overview

Our Electronic Potting, also called potting glue or encapsulation silicone, is a high-performance Silicone Encapsulant specially engineered for automation sensor systems—the core component ensuring precise detection and signal transmission in industrial automation. As a professional supplier of Thermally Conductive Potting Compound and industrial silicone solutions, we optimize this product for sensor scenarios: it bonds perfectly to PC, PMMA, PCB and metals (aluminum, copper, stainless steel), with excellent waterproof, moisture-proof, corrosion-resistant, insulation and shock absorption performance. It effectively protects sensor electronics from industrial dust, vibration, temperature fluctuations and electromagnetic interference, ensuring accurate, stable operation of automation sensor systems.

Technical Specifications

Our Electronic Potting has stable performance with fully customizable parameters; key specifications: it is dual-component addition-curing liquid silicone (A and B), A component needs full stirring to mix settled fillers, B component needs thorough shaking. A/B weight ratio is adjustable; optional vacuum defoaming (0.01MPa for 3 minutes) before pouring. It supports room-temperature or heated curing, basic curing for next process, full curing within 24 hours (temperature and humidity affect curing). It operates continuously from -60℃ to 220℃, with high dielectric strength, low volatility, high strength, excellent adhesion and efficient thermal conductivity. Shelf life is 12 months sealed, non-hazardous for transportation.

Product Features & Advantages

  • Excellent Anti-Electromagnetic Interference: Effectively shields industrial electromagnetic interference, ensuring accurate signal transmission of automation sensors, avoiding signal distortion and detection errors.
  • Superior Shock & Vibration Resistance: Absorbs industrial vibration and mechanical impact, protecting fragile sensor components (chips, welding wires) from damage, ensuring stable long-term operation.
  • Precise Signal Protection: Low volatility and excellent insulation, no contamination to precision sensor components, ensuring sensor detection accuracy and signal stability.
  • Wide Temperature & Environment Adaptability: Stable from -60℃ to 220℃, resisting industrial temperature fluctuations, humidity and corrosion, adapting to harsh industrial automation environments.
  • Strong Adhesion: Bonds firmly to various sensor materials, high structural strength, preventing potting layer detachment and ensuring long-term protective performance.
  • Dual Curing & Customizable: Available in addition-curing and condensation-curing types, adjustable curing speed and viscosity, adapting to small, precision automation sensor mass production.

How to Use (Step-by-Step)

  1. Pre-Mix Preparation: Thoroughly stir Component A to mix settled fillers evenly, shake Component B thoroughly; slight stratification during storage does not affect performance after stirring.
  2. Component Mixing: Strictly mix A and B according to specified weight ratio, stir continuously until homogeneous for optimal curing, insulation and signal protection.
  3. Vacuum Defoaming: Place mixed glue in a vacuum container, defoam at 0.01MPa for 3 minutes to remove bubbles, ensuring dense, bubble-free encapsulation and no signal interference gaps.
  4. Curing Process: Pour defoamed glue into automation sensor components, cure at room temperature or heat. Proceed to next process after basic curing; full curing (24 hours) ensures optimal protective performance.

Application Scenarios

This Electronic Potting is specifically for automation sensor systems, including industrial proximity sensors, temperature sensors, pressure sensors, position sensors and photoelectric sensors, widely used in manufacturing, automotive, robotics and smart factory automation. It is suitable for encapsulating sensor control boards, detection modules and signal transmitters. For automation equipment purchasers, it enhances sensor reliability, reduces failure rates from industrial harsh environments, extends service life, ensures accurate detection and signal transmission, improves automation production efficiency, lowers maintenance costs and boosts competitiveness in the global automation market.

Customization Options

We provide full customization for automation sensor requirements:
  • Adjust curing hardness, viscosity and operating time to match small, precision sensor sizes and production processes.
  • Optimize anti-interference and shock resistance to adapt to different industrial automation environments.
  • Customize A/B ratio and curing speed to meet precision sensor mass production needs.
  • Provide flexible packaging for small-batch R&D and large-scale production of automation sensors.

Certifications & Compliance

Our Electronic Potting meets international automation and electronic industry standards, holding ISO 9001, CE and RoHS certifications. It has stable batch performance, non-toxic, environmentally friendly, undergoes strict quality testing (anti-interference, shock resistance), widely trusted by global automation sensor manufacturers.

Production Process

Our production adheres to strict industrial standards: selecting high-purity Silicone raw materials, precise A/B mixing, vacuum defoaming, strict viscosity and hardness testing, professional packaging. Each batch undergoes rigorous performance testing to ensure it meets automation sensor application requirements, demonstrating our strong production capacity and quality assurance system.

FAQ

Q: Is this potting suitable for precision automation sensors?
A: Yes. It has low volatility and excellent signal protection, no contamination to precision components, ensuring sensor detection accuracy and stable signal transmission.
Q: How to store this potting silicone properly?
A: Seal and store in a cool, dry place; mixed glue should be used at one time. Stratification can be solved by stirring, without affecting performance.
Q: Can it resist industrial vibration and electromagnetic interference?
A: Yes. It has superior shock resistance and anti-electromagnetic interference performance, effectively protecting sensors from vibration damage and signal distortion.
Q: Can it be customized for small-size automation sensors?
A: Yes. We can customize viscosity, curing speed and hardness to match small, precision sensor sizes and your production process requirements.
 
 
 
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