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Home> Products> Electronic Potting Compound> Electronic Potting for Snubber Circuits
Electronic Potting for Snubber Circuits
Electronic Potting for Snubber Circuits
Electronic Potting for Snubber Circuits
Electronic Potting for Snubber Circuits
Electronic Potting for Snubber Circuits
Electronic Potting for Snubber Circuits

Electronic Potting for Snubber Circuits

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9020

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE Electronic Potting for Snubber Circuits is a specialized anti-surge Electronic Potting Compound and Silicone Encapsulant, tailored for snubber circuit encapsulation. As a two-component Addition Curing Silicone made of high-purity Silicone raw materials, it features excellent temperature resistance (-60℃ to 220℃), ultra-high insulation, low dielectric loss, anti-voltage surge, strong adhesion to PC/PMMA/PCB and metals, low volatility, non-hazardous, complying with EU RoHS, and supporting full parameter customization (around 198 characters).
 
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Product Overview

Our Electronic Potting for Snubber Circuits is a professional Silicone Potting Compound developed for the encapsulation, insulation, anti-surge and protection of Snubber Circuits. As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for snubber circuits’ core needs—high insulation, low dielectric loss, anti-voltage surge and protection of circuit components. Unlike ordinary potting silicones, it effectively suppresses voltage spikes, absorbs high-temperature cycle stress, protects internal resistors, capacitors and diodes, ensures stable surge suppression performance, and brings reliable protection for procurement partners.
 
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Key Features & Advantages

  1. Ultra-High Insulation & Anti-Voltage Surge: Excellent insulation performance (dielectric strength ≥25 kV/mm, volume resistivity ≥1.0×10¹⁶ Ω·cm), effectively isolating snubber circuit components; strong anti-voltage surge capability, suppressing voltage spikes and transients, avoiding component damage, ensuring stable circuit operation and reducing failure risks.
  2. Superior Temperature Stability & Stress Absorption: Operates stably from -60℃ to 220℃, with excellent high and low temperature resistance; can absorb stress caused by internal high-temperature cycles and voltage surges of snubber circuits, avoiding damage to resistors, capacitors, diodes and welding points, ensuring long-term stable operation in extreme industrial environments.
  3. Efficient Thermal Conductivity & Heat Dissipation: Integrated Thermally Conductive Potting Compound properties, efficiently dissipate heat generated by snubber circuits during surge suppression, avoid overheating-induced component burnout or performance degradation, extend product service life and reduce maintenance costs for procurement partners.
  4. Strong Adhesion & Wide Compatibility: High bonding strength to PC, PMMA, PCB and metals (copper, aluminum, stainless steel), forming a tight seal without detachment; good compatibility with snubber circuit components, no corrosion to resistors, capacitors or diodes, ensuring comprehensive protection against moisture, dust and corrosion.
  5. Low Volatility & Customizable Parameters: Low volatility, no harmful substances released during curing, ensuring the safety of precision circuit components; cured colloid has high strength and good shock absorption, reducing damage from external vibration; parameters such as hardness, viscosity, operation time and thermal conductivity can be customized to match different circuit sizes and working conditions.

How to Use (Step-by-Step Guide)

  1. Pre-Mixing Preparation: Fully stir Component A in its container to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting curing effect, insulation, thermal conductivity and anti-surge performance of snubber circuits.
  2. Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which may affect insulation, heat dissipation and surge suppression of internal circuit components.
  3. Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then pour it into snubber circuit casings, ensuring full infiltration of all components.
  4. Curing: Place the encapsulated snubber circuit at room temperature or heat to accelerate curing; enter the next process after basic curing, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed and final performance.

Application Scenarios

This specialized electronic potting compound and silicone encapsulant is mainly used for encapsulation, insulation, anti-surge and heat dissipation of various Snubber Circuits. It is widely applied in power electronics, industrial inverters, motor drives, switching power supplies, high-voltage equipment and electronic control systems. It ensures stable surge suppression performance of snubber circuits in harsh industrial environments, reduces failure rates caused by voltage spikes, overheating and corrosion, improves product reliability, and helps procurement partners reduce production costs and enhance market competitiveness.

Technical Specifications

Type: Two-Component Addition-Curing Electronic Potting Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Transparent/Light Transparent Liquid (both components); Viscosity: Customizable; Working Time: Customizable; Curing Time: 24 hours (full, room temp/heated optional); Operating Temperature: -60℃ to 220℃; Thermal Conductivity: Customizable; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (PC, PMMA, PCB, copper, aluminum, stainless steel); Volatility: Minimal; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Non-hazardous; Customizable parameters available.

Certifications & Compliance

Our Electronic Potting for Snubber Circuits complies with international standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global snubber circuit production requirements, trusted by global power electronics manufacturers and procurement partners.

Customization Options

We provide snubber circuit-specific customization: adjust viscosity, hardness, curing speed, insulation performance and thermal conductivity; optimize adhesion to PCB and circuit components; enhance anti-voltage surge capability and reduce dielectric loss; choose between addition curing silicone and enhanced thermally conductive potting compound; flexible parameter adjustment to meet small-batch and large-scale production needs.

Production Process & Quality Control

We implement a strict 5-step quality control process: high-puritysilicone raw materials screening, precision automated mixing, performance testing (insulation, anti-surge, temperature resistance, thermal conductivity), curing verification, and sealed packaging. Monthly capacity exceeds 500 tons, supporting stable global supply; non-hazardous, transportable as general chemicals.

FAQ

Q: Is it suitable for all types of snubber circuits?
A: Yes, it can be customized for different models and voltage levels of snubber circuits, with good compatibility and no impact on surge suppression performance.
Q: How to store the product?
A: Seal and store, shelf life is 12 months; stir evenly before use if stratified, no impact on performance.
Q: Can the mixed glue be stored for later use?
A: No, mixed glue should be used up at one time to avoid waste and curing failure.
Q: Is it hazardous?
A: No, it is non-hazardous and can be transported as general chemicals.
Q: What if it gets into eyes or mouth?
A: Rinse with clean water immediately or seek medical attention.
 
 
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