Product Overview
Our dedicated potting silicone is professionally customized for spiral inductor encapsulation, serving as a high-performance Electronic Potting Compound and flexible Silicone Encapsulant. This two-component liquid silicone cures into a tough, elastic protective layer after mixing A and B components. It effectively solves common spiral inductor defects including damp failure, heat accumulation, electric leakage and mechanical damage, stabilizing inductance performance and extending the service life of electronic inductive components.
Core Product Features & Advantages
1. Multi-dimensional protection: Integrates waterproof, moisture-proof, dust-proof, anti-corrosion, insulation and shockproof functions, fully isolating spiral inductors from external environmental interference.
2. Extreme temperature resistance: Stably operates at -60℃ to 220℃, absorbs thermal cycling stress, and protects inductor coils and gold welding wires without affecting inductive stability.
3. Low volatility & superior adhesion: Ultra-low volatile content avoids component contamination; firmly bonds with PCB, PMMA, CPU and metals like aluminum and copper for long-term tight sealing.
4. Excellent chemical stability: Resists ozone and chemical erosion, slowing inductor aging and reducing component replacement frequency for manufacturers.
5. Customizable performance: Adjustable viscosity, hardness, operation time and curing time to match different spiral inductor sizes and automated production processes.
Step-by-Step Usage Instructions
1. Pre-preparation: Fully stir Component A to homogenize precipitated fillers and shake Component B thoroughly before mixing.
2. Proportional mixing: Mix A and B components strictly per standard weight ratio and stir evenly to ensure uniform curing effect.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles, ensuring flawless inductor encapsulation.
4. Curing process: Adopt room temperature or heating curing; complete initial curing for subsequent procedures, with full curing finished within 24 hours. Temperature and humidity greatly affect curing speed.
Application Scenarios
This professional thermally conductive Potting Compound is specially developed for spiral inductor packaging, widely used in consumer electronics, industrial control equipment, communication devices and PCB circuit modules. It stabilizes inductor electrical performance, reduces product failure rates, lowers production and after-sales costs, and improves core competitiveness for electronic manufacturers. Technical Specifications
Product Type: Two-component silicone potting compound; Curing Type: Addition curing silicone & condensation curing; Working Temperature: -60℃~220℃; Core Performance: Insulating, thermally conductive, waterproof, anti-corrosive, shockproof; Adhesion Materials: PCB, PMMA, CPU, aluminum, copper, stainless steel; Volatility: Ultra-low; Customizable Parameters: Viscosity, hardness, operation time, curing time.
Certifications & Compliance
All our electronic encapsulation adhesive meets ISO quality management standards, CE and RoHS international certifications. Environmentally friendly and non-toxic, it complies with global electronic component packaging standards and supports large-scale industrial mass production.
Customization Options
We provide targeted customization for spiral inductor potting. Clients can adjust thermal conductivity, viscosity, curing speed and hardness to adapt to different inductor specifications and production environments.
Production & Quality Control
We implement standardized production with high-puritysilicone raw materials. Each batch of silicone encapsulant undergoes strict tests on temperature resistance, insulation, thermal conductivity and adhesion to ensure consistent and reliable packaging quality.
FAQ
Q: Does colloidal stratification affect potting quality?
A: Stratification may occur after long storage, but uniform stirring will not change original product performance.
Q: Can mixed potting silicone be stored?
A: Mixed glue must be used up at one time to avoid curing failure and material waste.
Q: What factors impact curing efficiency?
A: Ambient temperature and humidity are key factors; higher temperature accelerates the curing process.
Q: Will the glue affect spiral inductor performance?
A: The low-stress, low-volatility formula will not interfere with inductive parameters, ensuring stable electrical performance.
Shenzhen Hong Ye Jie Technology Co., Ltd
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