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Home> Products> Electronic Potting Compound> Electronic Potting for High Purity Applications
Electronic Potting for High Purity Applications
Electronic Potting for High Purity Applications
Electronic Potting for High Purity Applications
Electronic Potting for High Purity Applications
Electronic Potting for High Purity Applications
Electronic Potting for High Purity Applications

Electronic Potting for High Purity Applications

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-210

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound2
Product Description
Our high-purity Electronic Potting Compound is a premium Silicone Encapsulant designed for electronic component protection. Featuring waterproof, moistureproof, thermally conductive, flame retardant and insulating properties, this RTV silicone potting adhesive cures rapidly after mixing A and B components. It stably safeguards circuit boards and precision electronic parts, widely compatible with mainstream electronic materials. As one of our core Silicone raw materials, it matches the high-quality standards of our RTV 2 Silicone Rubber and industrial silicone product series.
 
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Product Overview

HONG YE SILICONE’s electronic potting silicone, also known as silicone encapsulant and electronic sealing adhesive, is a high-performance liquid silicone protective material. Classified into addition-curing and condensation-curing types, it delivers excellent adhesion and thermal stability for PCB, CPU, PC insulation boards and PMMA acrylic materials. Integrated with mature formulas of our Pad printing silicone rubber and industrial Mold Silicone series, it ensures stable and consistent performance for long-term electronic device operation.
 
electronic silicone

Core Product Features & Advantages

This Silicone Potting Compound stands out from ordinary encapsulation resins with superior comprehensive performance, bringing tangible cost and quality benefits for global buyers:
1. All-round protection: Integrates waterproof, dustproof, anti-corrosion, shockproof and insulating functions, realizing confidential encapsulation of electronic components.
2. Extreme temperature resistance: Operates stably from -60℃ to 220℃, effectively relieves thermal cycle stress and protects chips and gold bonding wires.
3. Excellent material compatibility: Low volatile content, high structural strength, and strong adhesion to aluminum, copper, stainless steel and other common metal materials.
4. Premium stability: Resists ozone and chemical erosion, adapting to complex industrial and outdoor operating environments.
5. Industrial synergy: Adopts mature platinum-cured technology consistent with our Mold Making Silicone, ensuring stable batch quality and reliable supply chain.

Application Scenarios

Tailored for high-purity electronic encapsulation scenarios, this Electronic Encapsulation Adhesive is widely used for sealing, filling, pressure resistance and insulation protection of various precision electronic components. It is ideal for CPU, PCB circuit boards, electronic insulation plates and optoelectronic device encapsulation, suitable for industrial electronics, consumer electronics and intelligent equipment manufacturing. It helps buyers reduce component damage rates, extend product service life and lower after-sales maintenance costs.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to homogenize precipitated fillers, and shake component B thoroughly before use.
2. Proportional mixing: Strictly follow the standard AB component weight ratio for uniform mixing.
3. Vacuum defoaming: Place the mixed silicone in a 0.01MPa vacuum container for 3 minutes of defoaming to eliminate bubbles.
4. Curing treatment: Adopt room-temperature or heating curing for addition-curing silicone. It can proceed to the next process after initial curing and achieves full curing within 24 hours. Curing effect is affected by ambient temperature and humidity.

Certifications & Compliance

All our electronic potting silicone products comply with international industry standards, supported by ISO9001, CE and UL certifications. The materials meet ROHS environmental requirements, featuring low volatility and high purity, fully compliant with global electronic product environmental protection and safety specifications, suitable for export to Europe, America, Southeast Asia and other mainstream markets.

Customization Options

We support personalized OEM customization based on buyer demands. Adjustable product parameters include cured hardness, viscosity, operating time and curing speed, meeting diverse high-purity encapsulation needs of different electronic equipment.

Production & Quality Control

As a professional silicone manufacturer with over 20 years of experience, we rely on 20 professional production lines and standardized QC management. Strict pre-production sample confirmation and pre-shipment full inspection are implemented to ensure batch stability, consistent with the quality control standards of our liquid silicone series products.

FAQ

Q1: How to store the unused potting silicone? A: Seal and store the glue tightly. Mixed AB glue should be used up at one time to avoid waste and performance degradation.
Q2: Is layered silicone usable? A: Long-term storage may cause slight stratification. Even stirring uniformly will not affect the original performance.
Q3: Is the product safe for industrial use? A: It is a non-hazardous industrial material, but contact with mouth and eyes is prohibited. Rinse with clean water immediately if accidental contact occurs.
 
 
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