Ms. zhou

What can I do for you?

Communicate
Ms. zhou

Ms. zhou

What can I do for you?

+86 18926763719
Contact now
  • All
  • Products

Select Language

Shenzhen Hong Ye Jie Technology Co., Ltd

English

Home> Products> Electronic Potting Compound> Electronic Potting for Nanoscale Components
Electronic Potting for Nanoscale Components
Electronic Potting for Nanoscale Components
Electronic Potting for Nanoscale Components
Electronic Potting for Nanoscale Components
Electronic Potting for Nanoscale Components
Electronic Potting for Nanoscale Components

Electronic Potting for Nanoscale Components

Get Latest Price
Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Contact Now
Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9040

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
Picture Example :

The file is encrypted. Please fill in the following information to continue accessing it

Inquire the password
Electronic potting silicone
Product Description
HONG YE SILICONE’s Electronic Potting Compound for Nanoscale Components is an ultra-high-precision Thermally Conductive Potting Compound developed for microscopic electronic structures. Formulated with high-purity RTV 2 Silicone Rubber and premium liquid silicone raw materials, it features ultra-low viscosity, zero micro-bubbles and ultra-fine fluidity. It fully covers and protects tiny nanoscale electronic parts, delivering stable insulation, heat dissipation and moisture resistance. Optimized with our mature Mold Making Silicone and Pad printing silicone rubber formulas, it solves micro-gap filling defects for high-end nano electronic manufacturing.
 
electronic silicone

Product Overview

This professional Silicone Potting Compound includes addition and condensation curing types, specially customized for fragile, tiny nanoscale electronic components. It is a multifunctional Electronic Encapsulation Adhesive with excellent adhesion and thermal stability for PCB, CPU, PC and PMMA materials. Different from ordinary potting products, it achieves seamless micro-level encapsulation, effectively protecting ultra-fine chips and tiny welding structures. As one of our core industrial Silicone raw materials, it supports high-precision production of miniature electronic devices.
 
electronic silicone

Core Product Features & Advantages

Tailored for nanoscale component protection, this electronic encapsulation adhesive owns exclusive advantages in micro-precision encapsulation:
1. Ultra-precision filling: Superfine fluidity fits micro nano gaps, realizing seamless encapsulation without micro voids or dead angles.
2. Full protective performance: Integrates waterproof, dustproof, anti-corrosion, shockproof and insulating functions, with outstanding ozone and chemical erosion resistance.
3. Wide temperature adaptability: Stably operates at -60℃ to 220℃, absorbs micro thermal cycle stress and protects fragile nano chips and gold wires.
4. High purity & stability: Extremely low volatile content, high structural strength, and excellent adhesion to aluminum, copper and stainless steel for long-term nano-device stability.

Application Scenarios

It is widely used for sealing, filling and pressure protection of nanoscale precision components, miniature PCB circuits, micro CPU modules and tiny optoelectronic parts. Ideal for microelectronics, wearable nano-devices, high-precision sensors and intelligent micro-equipment. It effectively reduces micro-component damage rates, improves finished product yield, and cuts manufacturers’ precision production costs.

Step-by-Step Usage Process

1. Pre-treatment: Fully stir component A to uniform precipitated fillers and shake component B thoroughly to ensure nano-level formula uniformity.
2. Accurate mixing: Strictly follow standard AB weight ratio for even mixing to avoid performance deviation in micro encapsulation.
3. Precision defoaming: Vacuum the mixed glue at 0.01MPa for 3 minutes to eliminate tiny bubbles that affect nano component accuracy.
4. Curing process: Adopt room or heating curing. Initial curing supports subsequent processing, and full curing completes within 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product passes ISO9001, CE, UL certifications and complies with ROHS environmental standards. With high purity and low volatility, it meets strict quality requirements of global high-end nano electronic industry and supports full export trade.

Customization Options

We provide professional OEM customization. Hardness, viscosity, operating time and curing speed can be finely adjusted to adapt to different nanoscale component processing standards.

Production & Quality Control

Benefiting from 20+ years of silicone manufacturing experience, we implement strict full-process QC. Pre-production sample testing and pre-shipment full inspection guarantee stable and consistent quality for high-precision nano encapsulation products.

FAQ

Q1: Can it fill invisible nano micro gaps? A: Yes. Ultra-fine fluidity enables complete filling of micro nano gaps with zero tiny bubbles, ensuring precision protection.
Q2: Does stored layered glue affect nano encapsulation? A: Slight stratification is normal. Uniform stirring restores original performance with no impact on micro-precision encapsulation effect.
Q3: How to store nano-grade potting silicone? A: Keep tightly sealed. Mixed glue should be used up at one time to avoid impurity contamination and performance attenuation.
 
 
Hot Products
Silicone Rubber for soft robotics
Silicone Rubber for soft robotics

Contact Now
Resin Sculpture Mold with Silicone Rubber
Resin Sculpture Mold with Silicone Rubber

Contact Now
Condensation Curing Silicone Mold for Gypsum Cornice
Condensation Curing Silicone Mold for Gypsum Cornice

Contact Now
High Quality Human Body Silicone
High Quality Human Body Silicone

Contact Now
Human Body Silicone for Life Casting Applications
Human Body Silicone for Life Casting Applications

Contact Now
Pad Printing Silicone for Children Toy
Pad Printing Silicone for Children Toy

Contact Now
Durable Electronic Encapsulation Material
Durable Electronic Encapsulation Material

Contact Now
Flexible Silicone for Pad Printing Solutions
Flexible Silicone for Pad Printing Solutions

Contact Now
High Quality Silicone Rubber for Transfer Printing
High Quality Silicone Rubber for Transfer Printing

Contact Now
Liquid Sealant Silicone for Air Purification Systems
Liquid Sealant Silicone for Air Purification Systems

Contact Now
Home> Products> Electronic Potting Compound> Electronic Potting for Nanoscale Components
Contact Us
zhou

Ms. zhou

Leave a message
Contact Now
Recommend
Contact Now
  • Send Inquiry

Copyright © 2026 Shenzhen Hong Ye Jie Technology Co., Ltd All rights reserved. Privacy Policy

Send Inquiry
*
*

Please Leave Us A Message

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Upload Attachment
Send