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Home> Products> Electronic Potting Compound> Electronic Potting for Wide Bandgap Devices
Electronic Potting for Wide Bandgap Devices
Electronic Potting for Wide Bandgap Devices
Electronic Potting for Wide Bandgap Devices
Electronic Potting for Wide Bandgap Devices
Electronic Potting for Wide Bandgap Devices
Electronic Potting for Wide Bandgap Devices

Electronic Potting for Wide Bandgap Devices

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9315

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound2
Product Description
HONG YE SILICONE’s Electronic Potting for Wide Bandgap Devices is a professional high-temperature resistant Thermally Conductive Potting Compound tailored for GaN and SiC wide bandgap semiconductor components. Made of high-purity RTV 2 Silicone Rubber and premium liquid silicone raw materials, it adapts to extreme high-temperature working characteristics of wide bandgap devices. Combining our mature Mold Making Silicone and Pad printing silicone rubber core technologies, this high-performance Silicone Potting Compound delivers stable insulation, heat dissipation and stress buffering, solving packaging failure pain points of new-generation wide bandgap electronic devices.
 
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Product Overview

This high-end Electronic Encapsulation Adhesive is divided into addition curing and condensation curing types, specially optimized for wide bandgap device packaging. It provides excellent adhesion and thermal stability for PCB, CPU, PC and PMMA substrates, as well as various semiconductor materials. It effectively absorbs extreme thermal cycling stress generated by high-frequency and high-temperature operation of wide bandgap devices, protecting internal wafers and gold bonding wires, while offering all-round waterproof, dustproof and anti-corrosion protection.
 
electronic silicone

Core Product Features & Advantages

Engineered exclusively for wide bandgap semiconductor devices, the product has unique competitive advantages over ordinary potting materials:
1. Ultra-wide temperature resistance: Stably operates from -60℃ to 220℃, perfectly adapting to the high-temperature working environment of GaN and SiC wide bandgap devices.
2. Superior stress relief: Flexible structure offsets thermal expansion and contraction stress, avoiding device cracking and performance attenuation during long-term high-frequency operation.
3. Full protective performance: Integrates insulation, heat dissipation, waterproof, moisture-proof and shockproof functions, with outstanding resistance to ozone and chemical erosion.
4. Stable bonding & low volatility: Low volatile content and high structural strength, firmly bonds aluminum, copper and stainless steel, ensuring long-term stable operation of precision semiconductor devices.

Application Scenarios

Suitable for encapsulation and sealing protection of all types of wide bandgap devices, including SiC and GaN power semiconductors, high-frequency RF devices and high-temperature resistant electronic modules. Widely used in new energy power electronics, aerospace equipment and high-end industrial control systems. It greatly improves the stability and service life of wide bandgap devices, reduces product defective rates and lowers manufacturers’ operational and after-sales costs.

Step-by-Step Usage Process

1. Pre-treatment: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure uniform mixing and stable performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes defoaming to eliminate tiny bubbles affecting semiconductor precision.
4. Curing process: Adopt room temperature or heating curing. The product can proceed to subsequent processes after initial curing, with full curing completed within 24 hours.

Certifications & Compliance

As reliable industrial Silicone raw materials, our products pass ISO9001, CE and UL certifications and comply with ROHS environmental standards, meeting international high-end semiconductor device packaging specifications.

Customization Options

We support personalized OEM customization. Hardness, viscosity, operating time and curing speed can be adjusted to match different wide bandgap device packaging processes.

Production & Quality Control

With professional silicone manufacturing experience, we implement standardized production and strict full-process QC. Pre-production sample testing and pre-shipment full inspection ensure stable and consistent batch quality.

FAQ

Q1: Can it adapt to high-temperature operation of wide bandgap devices? A: Yes. It features excellent high and low temperature resistance, maintaining stable protection performance under long-term high-temperature working conditions of wide bandgap semiconductors.
Q2: Does colloidal stratification affect semiconductor packaging? A: Slight stratification is normal after long storage. Even stirring will not affect encapsulation protection and bonding performance.
Q3: What is the correct storage method? A: Keep sealed and stored in a dry environment. Mixed AB glue should be used up at one time to prevent performance degradation.
 
 
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