Product Overview
This professional Electronic Encapsulation Adhesive includes addition curing and condensation curing formulas, serving as core industrial Silicone raw materials for low leakage current electronic packaging. It features excellent adhesion and sealing performance for PCB, CPU, PC and PMMA substrates, as well as common metal materials. After full curing, it forms a compact void-free insulation layer that blocks leakage paths, absorbs thermal cycling stress, and protects chips and gold bonding wires while offering waterproof, dustproof and anti-corrosion protection.
Core Product Features & Advantages
Specially optimized for low leakage current working requirements, it outperforms ordinary potting silicone in insulation stability:
1. Ultra-low leakage current: Dense cured structure achieves excellent dielectric isolation, effectively restraining micro current leakage and ensuring stable operation of precision electronic devices.
2. All-round environmental resistance: Possesses outstanding waterproof, moisture-proof, shockproof and anti-corrosion performance, with strong resistance to ozone and chemical erosion.
3. Wide temperature stability: Works continuously and stably from -60℃ to 220℃, relieves internal thermal stress and avoids insulation failure caused by temperature changes.
4. High stability & strong adhesion: Low volatile content and high mechanical strength, firmly bonds aluminum, copper and stainless steel without insulation performance degradation.
Application Scenarios
Ideal for encapsulation and insulation sealing of precision sensors, low-power precision circuits, medical electronic modules and high-sensitivity control boards requiring low leakage current. Widely applied in precision instrumentation, smart electronics and automotive sensitive electronic systems. It reduces current loss and circuit failure rates, improves device accuracy and stability, and cuts manufacturers’ product defect and maintenance costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to uniform settled fillers and shake component B thoroughly to ensure formula uniformity.
2. Accurate mixing: Strictly follow standard AB component weight ratio to guarantee stable insulation and low leakage performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3-minute defoaming to avoid tiny bubbles causing current leakage risks.
4. Curing treatment: Adopt room temperature or heating curing. Initial curing supports subsequent processing, and full curing is completed within 24 hours.
Certifications & Compliance
The products comply with ISO9001, CE, UL and ROHS international standards. With high purity and stable insulation properties, they meet strict low-leakage electronic industry specifications for global export applications.
Customization Options
Custom services are available. Product viscosity, hardness, operating time and curing speed can be adjusted to fit different low leakage current electronic packaging processes.
Production & Quality Control
We adopt standardized production and strict full-process quality inspection. Pre-production sample verification and pre-shipment testing ensure consistent low leakage current performance of batch products.
FAQ
Q1: Can this potting silicone effectively reduce circuit leakage current? A: Yes. Its high-density insulation structure greatly reduces current leakage, maintaining high precision and stability of sensitive electronic circuits.
Q2: Will stored colloidal stratification affect low-leakage performance? A: Slight stratification is normal. Even stirring will not damage insulation and low leakage current performance.
Q3: How to store the low leakage current Potting Compound? A: Keep sealed and dry. Mixed AB glue should be used up at one time to avoid performance attenuation and insulation failure.