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Home> Products> Electronic Potting Compound> Electronic Potting for Large Die Attach
Electronic Potting for Large Die Attach
Electronic Potting for Large Die Attach
Electronic Potting for Large Die Attach
Electronic Potting for Large Die Attach
Electronic Potting for Large Die Attach
Electronic Potting for Large Die Attach

Electronic Potting for Large Die Attach

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9045

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting
Product Description
This high-performanceSilicone Potting Compound is divided into addition-curing and condensation-curing types, serving as a core Electronic Encapsulation Adhesive for large die attach packaging. It offers outstanding adhesion and thermal stability for CPU, PCB, PC and PMMA substrates. Different from ordinary potting glue, it provides uniform stress buffer and firm overall coverage for large-area chips, effectively protecting wafer structures and bonding gold wires during long-term high-temperature operation. Electronic Potting Compound, Silicone Potting Compound, Silicone raw materials, Silicone Encapsulant.
 
HY-factory

Core Product Features & Advantages

Specially engineered for large die attach packaging, the product possesses unique superior properties for big-size chip protection:
1. High bonding strength: Excellent adhesion to aluminum, copper, stainless steel and circuit board materials, preventing delamination of large-area die attach layers.
2. Superior stress relief: Flexible silicone structure absorbs thermal cycling stress, avoiding chip cracking caused by large-area temperature difference deformation.
3. Extreme weather resistance: Stably works from -60℃ to 220℃, with great resistance to ozone and chemical erosion for long-term packaging stability.
4. Comprehensive protection: Integrates waterproof, moisture-proof, dust-proof, insulating and shockproof functions, with low volatile content and high overall structural strength.
 
electronic silicone

Application Scenarios

Ideal for large die attach encapsulation, chip bonding filling and sealing protection of large-size CPU, power semiconductor chips and industrial PCB modules. Widely applied in power electronics, automotive electronics and industrial control equipment. It effectively reduces large-area chip failure rates, improves packaging yield and lowers manufacturers’ after-sales maintenance and replacement costs.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and shake component B sufficiently before mixing.
2. Proportional mixing: Strictly follow standard AB weight ratio to ensure uniform mixing and stable bonding performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes defoaming to eliminate bubbles on large die attach surfaces.
4. Curing treatment: Adopt room temperature or heating curing. It can proceed to the next process after initial curing and achieves full curing within 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

The product holds ISO9001, CE and UL certifications and complies with ROHS environmental standards. With high purity and stable performance, it meets international industrial electronic packaging standards and supports global export business.

Customization Options

We support professional OEM customization. Hardness, viscosity, operating time and curing speed can be adjusted to match different large die attach packaging processes and equipment requirements.

Production & Quality Control

With over 20 years of silicone manufacturing experience, we implement standardized production and strict QC procedures. Pre-production sample confirmation and pre-shipment full inspection ensure stable batch quality for large-area encapsulation products.

FAQ

Q1: Can it prevent large die attach delamination and cracking? A: Yes. It features high adhesion and flexible stress buffering, effectively solving delamination and cracking problems of large-size chip packaging.
Q2: Is layered silicone usable for chip packaging? A: Slight stratification after long storage is normal. Even stirring will not affect bonding and encapsulation performance.
Q3: What is the correct storage method? A: Store in sealed condition. Mixed AB glue must be used up at one time to avoid performance deterioration and waste.
 
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