Product Overview
This low insertion loss potting silicone includes addition and condensation curing types, serving as a high-performance Thermally Conductive Potting Compound for high-frequency circuits and signal devices. It delivers excellent adhesion and sealing performance for PCB, CPU, PC and PMMA substrates. The cured silicone maintains consistent dielectric stability, effectively reducing signal insertion loss, absorbing thermal cycling stress, and shielding core chips and gold bonding wires of precision communication equipment.
Core Product Features & Advantages
Specially optimized for high-frequency signal scenarios, the product stands out with low loss performance and comprehensive protection:
1. Ultra-low insertion loss: Stable high-frequency dielectric properties minimize signal attenuation, no signal distortion or interference, ideal for precision communication devices.
2. Full protective performance: Integrates waterproof, moisture-proof, dust-proof, anti-corrosion and shockproof functions, with excellent ozone and chemical erosion resistance.
3. Wide temperature stability: Operates stably from -60℃ to 220℃, maintains low-loss signal performance during long-term temperature cycling.
4. Superior adhesion & low volatility: Low volatile content and high structural strength, firmly bonds aluminum, copper and stainless steel without affecting circuit signal stability.
Application Scenarios
Widely used for encapsulation and protection of high-frequency PCB boards, communication modules, signal sensors and precision radio frequency devices. Ideal for 5G communication equipment, intelligent sensing devices and high-precision electronic modules. It effectively reduces signal transmission loss, improves device signal accuracy and stability, and lowers manufacturers’ product failure and after-sales costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Proportional mixing: Strictly follow standard AB weight ratio to ensure uniform mixing and stable low-loss performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes defoaming to prevent bubbles from interfering with signal transmission.
4. Curing treatment: Adopt room temperature or heating curing. Initial curing supports subsequent processing, and full curing is completed within 24 hours.
Certifications & Compliance
As reliable industrial Silicone raw materials, our products pass ISO9001, CE and UL certifications and comply with ROHS standards. They meet global precision electronic industry specifications, supporting worldwide export trade. Customization Options
We provide professional OEM customization. Viscosity, hardness, operating time and curing speed can be adjusted to fit different high-frequency device encapsulation processes.
Production & Quality Control
With 20+ years of manufacturing experience, we implement standardized production and strict full-process QC. Pre-production sample testing and pre-shipment inspection guarantee stable low insertion loss performance for batch products.
FAQ
Q1: Will the potting silicone affect high-frequency signal transmission? A: No. The product features ultra-low insertion loss and stable dielectric properties, causing no signal attenuation or interference.
Q2: Is layered silicone usable for precision signal devices? A: Slight stratification is normal. Even stirring restores original performance with no impact on low-loss signal transmission.
Q3: What is the correct storage method? A: Store in sealed dry conditions. Mixed AB glue should be used up at one time to avoid performance degradation.