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Home> Products> Electronic Potting Compound> Electronic Potting for High Power Density
Electronic Potting for High Power Density
Electronic Potting for High Power Density
Electronic Potting for High Power Density
Electronic Potting for High Power Density
Electronic Potting for High Power Density
Electronic Potting for High Power Density

Electronic Potting for High Power Density

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9310

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound3
Product Description
HONG YE SILICONE’s Electronic Potting for High Power Density is a high-efficiency Thermally Conductive Potting Compound designed for compact high-power electronic modules. Formulated with premium RTV 2 Silicone Rubber and high-purity liquid silicone raw materials, it features excellent heat dissipation and stress resistance. Optimized with our mature Mold Making Silicone and Pad printing silicone rubber formulas, this high-performance Silicone Potting Compound solves overheating failure issues of densely arranged power components, delivering stable thermal management and full physical protection for high-power devices.
 
HY-factory

Product Overview

This professional Electronic Encapsulation Adhesive includes addition-curing and condensation-curing formulas, specially developed for high power density electronic assemblies. It offers outstanding adhesion, sealing and thermal stability for PCB, CPU, PC and PMMA materials. Cured silicone efficiently conducts and dissipates concentrated heat generated by dense power components, absorbs thermal expansion stress, and protects chips and gold bonding wires from high-temperature burnout and mechanical damage.
 
ectronic silicone

Core Product Features & Advantages

Tailored for high power density working conditions, the product boasts exclusive thermal management and comprehensive protective strengths:
1. Excellent high-power heat dissipation: High thermal conductivity solves heat accumulation of compact high-power components, effectively lowering operating temperature.
2. Multi-functional protection: Integrates waterproof, moisture-proof, dust-proof, anti-corrosion and insulation properties, with strong resistance to ozone and chemical erosion.
3. Extreme temperature adaptability: Stably operates at -60℃ to 220℃, relieves thermal cycling stress and prevents component cracking in long-term high-load operation.
4. Reliable stability & adhesion: Low volatile content and high mechanical strength, firmly bonds aluminum, copper and stainless steel, adapting to long-term high-power continuous operation.

Application Scenarios

Ideal for encapsulation and thermal protection of high power density circuit boards, power supply modules, automotive power electronics and compact industrial high-power components. Widely applied in new energy equipment, industrial control systems and high-load electronic devices. It optimizes heat dissipation efficiency, reduces high-temperature failure rates, extends device service life and cuts manufacturers’ production and maintenance costs.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly for consistent performance.
2. Standard mixing: Strictly follow AB component weight ratio to ensure uniform mixing and stable thermal conductivity.
3. Vacuum defoaming: Place mixed glue in a 0.01MPa vacuum container for 3 minutes defoaming to avoid bubble gaps affecting heat dissipation.
4. Curing operation: Adopt room temperature or heating curing. Initial curing allows subsequent processing, with full curing completed within 24 hours.

Certifications & Compliance

As qualified industrial Silicone raw materials, our products pass ISO9001, CE and UL certifications and comply with ROHS environmental standards, meeting global high-power electronic industry safety and quality specifications.

Customization Options

We support professional OEM customization. Viscosity, hardness, thermal conductivity and curing time can be adjusted to match different high power density encapsulation processes.

Production & Quality Control

With 20+ years of silicone manufacturing experience, we implement standardized production and strict full-process QC. Pre-production testing and pre-shipment inspection ensure stable heat dissipation and protective performance for batch products.

FAQ

Q1: Can it solve heat accumulation of high power density components? A: Yes. Its high thermal conductivity structure rapidly exports concentrated heat, avoiding overheating and component burnout.
Q2: Does colloidal stratification affect heat dissipation performance? A: Slight stratification is normal. Even stirring will not damage thermal conductivity and comprehensive protection performance.
Q3: How to store high-power potting silicone? A: Keep sealed and dry. Mixed AB glue should be used up at one time to avoid performance attenuation.
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