Product Overview
Our customized potting silicone is exclusively developed for interdigital capacitor encapsulation, acting as a high-stability Electronic Potting Compound and flexible Silicone Encapsulant. This two-component liquid silicone cures into a soft, stress-free protective layer after AB component mixing. It effectively solves core pain points of interdigital capacitors such as moisture intrusion, thermal fatigue, electric leakage and mechanical pressure damage, stabilizing capacitance accuracy and prolonging component service life.
Core Product Features & Advantages
1. Precision full protection: Integrates waterproof, moisture-proof, dust-proof, anti-corrosion, insulation and shockproof functions to shield delicate interdigital electrode structures from external interference.
2. Wide temperature adaptability: Stably operates from -60℃ to 220℃, absorbs thermal cycling stress, and protects capacitor chips and gold welding wires without affecting electrical stability.
3. Low volatility & strong adhesion: Ultra-low volatile content avoids micro contamination; firmly bonds with PCB, PMMA, CPU and multiple metals including aluminum and copper for long-term reliable sealing.
4. Superior chemical resistance: Resists ozone and chemical erosion, slowing component aging, reducing failure rates and cutting manufacturers’ replacement costs.
5. Flexible customizable performance: Adjustable viscosity, hardness, operation time and curing time to match diverse interdigital capacitor sizes and automated precision production lines.
Step-by-Step Usage Instructions
1. Pre-preparation: Fully stir Component A evenly to homogenize precipitated fillers and shake Component B thoroughly before mixing.
2. Proportional mixing: Mix A and B components strictly per standard weight ratio and stir uniformly to ensure consistent curing performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to eliminate bubbles for flawless precision encapsulation.
4. Curing process: Cure via room temperature or heating mode; achieve initial curing for subsequent processes, with full curing completed within 24 hours. Ambient temperature and humidity significantly affect curing speed.
Application Scenarios
This professional thermally conductive Potting Compound is dedicated to interdigital capacitor packaging, widely applied in precision sensors, communication electronics, industrial control modules and PCB micro-components. It effectively stabilizes capacitor electrical performance, reduces product defect rates, lowers production and after-sales costs, and enhances manufacturers’ market competitiveness. Technical Specifications
Product Type: Two-component silicone potting compound; Curing Type: Addition curing silicone & condensation curing; Working Temperature: -60℃~220℃; Core Performance: High insulation, thermal conductivity, waterproof, anti-corrosive, shockproof; Adhesion Substrates: PCB, PMMA, CPU, aluminum, copper, stainless steel; Volatility: Ultra-low; Customizable Parameters: Viscosity, hardness, operation time, curing time.
Certifications & Compliance
All our electronic encapsulation adhesive complies with ISO quality standards, CE and RoHS international certifications. Non-toxic and environmentally friendly, it meets global precision electronic packaging standards and supports large-scale industrial production.
Customization Options
We provide exclusive customization for interdigital capacitor potting. Clients can adjust thermal conductivity, viscosity, curing speed and hardness to adapt to different capacitor specifications and production environments.
Production & Quality Control
We adopt standardized production with high-purity silicone raw materials. Every batch of silicone encapsulant undergoes strict tests on temperature resistance, insulation, thermal conductivity and adhesion to ensure stable and reliable packaging quality.
FAQ
Q: Does colloidal stratification affect encapsulation effect?
A: Stratification may occur after long storage, but uniform stirring will not alter original performance.
Q: Can mixed potting silicone be stored?
A: Mixed glue must be used up immediately to avoid curing failure and waste.
Q: What affects curing efficiency?
A: Ambient temperature and humidity are key factors; higher temperature accelerates curing.
Q: Will the silicone interfere with capacitor performance?
A: Low-stress and low-volatility formula causes no interference with interdigital capacitor electrical parameters.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
