Product Overview
Our Electronic Potting for Active Rectifier Bridges is a professional Silicone Potting Compound developed for the encapsulation, insulation, heat dissipation and protection of Active Rectifier Bridges. As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for active rectifier bridges’ core needs—high insulation, efficient heat dissipation, stable electrical performance and protection of rectifier chips. Unlike ordinary potting silicones, it effectively dissipates heat from high-current operation, absorbs high-temperature cycle stress, protects internal rectifier diodes and chips, ensures stable rectification efficiency, and brings reliable protection for procurement partners.
Key Features & Advantages
- Ultra-High Insulation & Stable Electrical Performance: Excellent insulation performance (dielectric strength ≥25 kV/mm, volume resistivity ≥1.0×10¹⁶ Ω·cm), effectively isolating active rectifier bridge circuits; low dielectric loss, avoiding signal interference and current leakage, ensuring stable rectification efficiency and reducing power loss for procurement partners.
- Superior Temperature Stability & Stress Absorption: Operates stably from -60℃ to 220℃, with excellent high and low temperature resistance; can absorb stress caused by internal high-temperature cycles and high-current operation of active rectifier bridges, avoiding damage to rectifier chips, diodes and welding points, ensuring long-term stable operation in extreme industrial environments.
- Efficient Thermal Conductivity & Heat Dissipation: Integrated Thermally Conductive Potting Compound properties, efficiently dissipate heat generated by active rectifier bridges during high-current rectification, avoid overheating-induced chip burnout or performance degradation, extend product service life and reduce maintenance costs.
- Strong Adhesion & Wide Compatibility: High bonding strength to PC, PMMA, PCB and metals (copper, aluminum, stainless steel), forming a tight seal without detachment; good compatibility with active rectifier bridge components, no corrosion to chips or diodes, ensuring comprehensive protection against moisture, dust and corrosion.
- Low Volatility & Customizable Parameters: Low volatility, no harmful substances released during curing, ensuring the safety of precision rectifier components; cured colloid has high strength and good shock absorption, reducing damage from external vibration; parameters such as hardness, viscosity, operation time and thermal conductivity can be customized to match different bridge sizes and working conditions.
How to Use (Step-by-Step Guide)
- Pre-Mixing Preparation: Fully stir Component A in its container to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting curing effect, insulation, thermal conductivity and electrical performance of active rectifier bridges.
- Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which may affect insulation, heat dissipation and rectification efficiency of internal components.
- Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then pour it into active rectifier bridge casings, ensuring full infiltration of all components.
- Curing: Place the encapsulated active rectifier bridge at room temperature or heat to accelerate curing; enter the next process after basic curing, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed and final performance.
Application Scenarios
This specializedelectronic potting compound and silicone encapsulant is mainly used for encapsulation, insulation, heat dissipation and protection of various Active Rectifier Bridges. It is widely applied in power electronics, renewable energy equipment, electric vehicles, switching power supplies, industrial rectifiers and electronic control systems. It ensures stable rectification performance of active rectifier bridges in harsh industrial environments, reduces failure rates caused by overheating, corrosion and interference, improves product reliability, and helps procurement partners reduce production costs and enhance market competitiveness.
Technical Specifications
Type: Two-Component Addition-Curing Electronic Potting Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Transparent/Light Transparent Liquid (both components); Viscosity: Customizable; Working Time: Customizable; Curing Time: 24 hours (full, room temp/heated optional); Operating Temperature: -60℃ to 220℃; Thermal Conductivity: Customizable; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (PC, PMMA, PCB, copper, aluminum, stainless steel); Volatility: Minimal; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Non-hazardous; Customizable parameters available.
Certifications & Compliance
Our Electronic Potting for Active Rectifier Bridges complies with international standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global active rectifier bridge production requirements, trusted by global power electronics manufacturers and procurement partners.
Customization Options
We provide active rectifier bridge-specific customization: adjust viscosity, hardness, curing speed, insulation performance and thermal conductivity; optimize adhesion to PCB and rectifier components; enhance anti-electromagnetic interference performance; choose between addition curing silicone and enhanced thermally conductive potting compound; flexible parameter adjustment to meet small-batch and large-scale production needs.
Production Process & Quality Control
We implement a strict 5-step quality control process: high-purity silicone raw materials screening, precision automated mixing, performance testing (insulation, heat dissipation, temperature resistance, electrical performance), curing verification, and sealed packaging. Monthly capacity exceeds 500 tons, supporting stable global supply; non-hazardous, transportable as general chemicals.
FAQ
Q: Is it suitable for all types of active rectifier bridges?
A: Yes, it can be customized for different models and current levels of active rectifier bridges, with good compatibility and no impact on rectification efficiency.
Q: How to store the product?
A: Seal and store, shelf life is 12 months; stir evenly before use if stratified, no impact on performance.
Q: Can the mixed glue be stored for later use?
A: No, mixed glue should be used up at one time to avoid waste and curing failure.
Q: Is it hazardous?
A: No, it is non-hazardous and can be transported as general chemicals.
Q: What if it gets into eyes or mouth?
A: Rinse with clean water immediately or seek medical attention.
Shenzhen Hong Ye Jie Technology Co., Ltd
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