Product Overview
Our Electronic Potting for Thermopile Sensors is a professional Silicone Encapsulant customized for thermopile sensor packaging and protection. As a specialized Electronic Potting Compound, it adopts two-component liquid design, which cures steadily after mixing A and B components. It solves core industry pain points of sensor dampness, heat accumulation, electric leakage and mechanical damage, delivering stable sealing, heat dissipation and insulation protection for thermopile sensors in various precision electronic devices.
Core Product Features & Advantages
1. Multi-protection performance: Integrates waterproof, moisture-proof, dust-proof, anti-corrosion, shockproof and insulation functions, fully isolating thermopile sensors from external harsh environments.
2. Excellent thermal stability: Works continuously from -60℃ to 220℃, effectively relieves thermal cycling stress and protects sensor chips and welding lines.
3. Superior adhesion and durability: Low volatile content and high structural strength, firmly adheres to PCB, CPU, PMMA and metals like aluminum and copper with stable sealing performance.
4. Chemical resistance: Resists ozone and chemical erosion, preventing sensor aging and failure for long-term stable operation.
5. Customizable performance: Adjustable viscosity, curing time and hardness to match different thermopile sensor assembly processes.
Step-by-Step Usage Instructions
1. Pre-stirring: Fully stir component A to homogenize precipitated fillers and shake component B evenly before use.
2. Proportional mixing: Mix A and B components strictly according to the standard weight ratio and stir uniformly.
3. Defoaming treatment: Place the mixed glue in a vacuum container under 0.01MPa for 3 minutes to remove bubbles for flawless potting.
4. Curing process: Adopt room-temperature or heating curing; reach preliminary curing for next procedures and full curing within 24 hours, with temperature and humidity affecting curing speed.
Application Scenarios
This professionalthermally conductive potting compound is specially formulated for thermopile sensor encapsulation, widely used in precision electronic sensors, PCB boards, CPU modules and industrial electronic components. It provides reliable sealing, heat dissipation and insulation protection for temperature sensing equipment, effectively reducing sensor failure rate, lowering after-sales costs and improving product stability for electronic manufacturers.
Technical Specifications
Product Type: Two-component silicone potting compound; Curing Type: Addition curing silicone & condensation curing; Working Temperature: -60℃~220℃; Core Performance: Thermal conductive, insulating, waterproof, shockproof; Adhesion Substrates: PCB, CPU, PMMA, aluminum, copper, stainless steel; Volatility: Low; Customizable Parameters: Viscosity, hardness, operation time, curing time.
Certifications & Compliance
All our electronic encapsulation adhesive products comply with international industrial standards, including CE and RoHS certification, and follow ISO quality management systems. Non-toxic and environmentally friendly, they meet global electronic industry packaging requirements and are safe for mass industrial production.
Customization Options
We support personalized customization for thermopile sensor potting needs. Customers can adjust glue viscosity, thermal conductivity, curing speed and hardness to adapt to different sensor sizes, production processes and working environments.
Production & Quality Control
We adopt standardized production with high-purity silicone raw materials. Strict performance tests on thermal conductivity, insulation, adhesion and temperature resistance are implemented before delivery, ensuring every batch of silicone encapsulant maintains stable and consistent quality.
FAQ
Q: Will colloidal stratification affect performance?
A: Stratification may occur after long-term storage, but uniform stirring will not affect original performance.
Q: Can mixed glue be stored for later use?
A: Mixed potting compound must be used up at one time to avoid curing failure and waste.
Q: What factors affect curing speed?
A: Ambient temperature and humidity are the main factors; higher temperature accelerates curing.
Q: Is the product safe for industrial use?
A: It is non-hazardous, but skin and eye contact should be avoided during operation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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