Product Overview
Our Electronic Potting Silicone for Bolometer Detectors is a professional Silicone Encapsulant tailored for precision bolometer detector packaging and protection. As a premium Electronic Potting Compound, it adopts a two-component liquid formula that cures into a flexible protective layer after mixing A and B components. It effectively solves common industry pain points including detector moisture damage, heat accumulation, electric leakage and mechanical pressure damage, delivering stable sealing, heat dissipation and insulation for high-precision bolometer sensing devices.
Core Product Features & Advantages
1. Full protective performance: Integrates waterproof, moisture-proof, dust-proof, anti-corrosion, insulation and shock absorption functions to fully isolate bolometer detectors from complex external environments.
2. Ultra-wide temperature resistance: Stably operates from -60℃ to 220℃, absorbs thermal cycling stress, and protects detector chips and gold welding wires from thermal damage.
3. Superior adhesion & stability: Low volatile content and high structural strength, firmly bonding with PCB, PMMA, CPU and various metals like aluminum and copper for long-term tight sealing.
4. Excellent chemical resistance: Resists ozone and chemical erosion, preventing detector aging and performance attenuation to extend device service life.
5. Flexible customization: Adjustable viscosity, curing time and hardness to match different bolometer detector sizes and automated production processes.
Step-by-Step Usage Instructions
1. Pre-treatment: Fully stir Component A to homogenize precipitated fillers and shake Component B evenly before mixing.
2. Proportional mixing: Mix A and B components strictly per standard weight ratio and stir uniformly without dead angles.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3 minutes to remove bubbles for precise potting.
4. Curing process: Cure at room temperature or with heating; achieve initial curing for subsequent processes and full curing within 24 hours, with temperature and humidity affecting curing efficiency.
Application Scenarios
This professional thermally conductive Potting Compound is specially developed for bolometer detector encapsulation, widely applied in infrared sensing detectors, precision electronic components, PCB modules and industrial sensing equipment. It improves detector operational stability, reduces failure and maintenance costs, and helps electronic manufacturers enhance product competitiveness. Technical Specifications
Product Type: Two-component silicone potting compound; Curing Type: Addition curing silicone & condensation curing; Working Temperature: -60℃~220℃; Core Performance: Thermal conductive, insulating, waterproof, shockproof, anti-corrosive; Adhesion Materials: PCB, PMMA, CPU, aluminum, copper, stainless steel; Volatility: Low; Customizable Parameters: Viscosity, hardness, operation time, curing time.
Certifications & Compliance
All our electronic encapsulation adhesive complies with ISO quality standards, CE and RoHS certifications. Environmentally friendly and non-toxic, it meets global precision electronic packaging standards and supports large-scale industrial mass production.
Customization Options
We provide exclusive customization for bolometer detector potting demands. Clients can adjust thermal conductivity, viscosity, curing speed and hardness to adapt to different detector models and production environments.
Production & Quality Control
We adopt standardized production with high-purity silicone raw materials. Every batch of silicone encapsulant undergoes strict tests on temperature resistance, insulation, adhesion and thermal conductivity to ensure stable and reliable quality.
FAQ
Q: Does colloidal stratification affect potting performance?
A: Stratification may occur after long storage, but even stirring will not change original performance.
Q: Can mixed potting silicone be reserved?
A: Mixed glue must be used up immediately to avoid curing failure and waste.
Q: What affects the curing speed?
A: Ambient temperature and humidity are key factors; higher temperature accelerates the curing process.
Q: Is the product safe for precision sensors?
A: It is non-toxic and low-volatile, perfectly safe for high-precision bolometer detector packaging.
Shenzhen Hong Ye Jie Technology Co., Ltd
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